Beyond Design: Skip-layer Routing—The Waveguide Structure That Makes 224G Possible
Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets
Elementary, Mr. Watson: Builders of the Dream
The Fraunhofer Institute for Photonic Microsystems IPMS Fraunhofer Institute for Photonic Microsystems IPMS is becoming a meeting point for international cutting-edge research in microelectronics: with the renowned International Conference on IC Design and Technology 2026 (ICICDT 2026), the institute is bringing leading experts from industry and academia to Dresden. For three days, Dresden will become an international hub for discussing the latest developments in integrated circuits.
From 22 to 24 June 2026, the renowned conference “International Conference on IC Design and Technology 2026” (ICICDT 2026) will bring together globally recognized specialists in IC design, semiconductor technologies, and system integration in Dresden. ICICDT is an international platform for exchanging innovations in micro- and nanoelectronics and covers key future fields such as chiplet integration, 2.5D/3D packaging, new materials, as well as applications in AI and IoT.
This year’s event is centered around the guiding theme: “From Integrated Devices to Integrated Chiplets: Design, Device and System Innovation for the Future”. It highlights the increasing interconnection of design, technology, and system integration as a key driver for the next generation of semiconductor development.
A combination of visionary keynotes, high-level invited talks, and application-oriented tutorials
“With ICICDT 2026, we are bringing the international elite of IC design and semiconductor technology to Dresden. The combination of visionary keynotes, high-level invited talks, and application-oriented tutorials creates a unique platform for innovation and international exchange,” explains Dr. Wenke Weinreich, General Chair of the conference and Deputy Director of Fraunhofer IPMS. “This close integration of research and industrial practice is crucial for transferring new technologies into applications more quickly.”
A special highlight of the conference program is the high-profile keynote lineup: international leaders from industry and research will provide insights into strategic developments, technological trends, and future challenges of the global semiconductor industry. Arnaud Furnémont (imec) will provide insights into next-generation computing and its feasibility. Gert Leusink (Tokyo Electron) will discuss challenges and opportunities for materials and semiconductor processes in the era of artificial intelligence. An Tran (Mixer Design Group) will show how wearable devices and edge AI are changing requirements for semiconductor design and packaging. The keynote program is complemented by a talk from Cheng Wang (MIPS) on circuit design for AI applications.
Already at the start of the conference, practice-oriented tutorials will offer participants the opportunity to engage intensively with key technologies and modern design approaches. Led by internationally recognized experts from companies such as Samsung Electronics and Intel, as well as renowned research institutions such as imec, TU Dresden, Hiroshima University, and the University of Liverpool (XJTLU), these formats promote knowledge transfer and direct exchange, particularly with early-career researchers.
The conference specifically promotes interdisciplinary dialogue across the entire value chain—from design and technology development to manufacturing. The goal is to accelerate innovation, initiate new collaborations, and further strengthen the international networking of the microelectronics community. By hosting ICICDT 2026, Fraunhofer IPMS underscores its role as a globally connected research partner in microelectronics. At the same time, the event strengthens Dresden’s position as one of Europe’s leading semiconductor industry hotspots within the “Silicon Saxony” cluster.
