Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

New York Imposes One-Year Moratorium on New AI Data Centers

07/15/2026 | I-Connect007 Editorial Team
New York has become the first U.S. state to impose a temporary statewide moratorium on new hyperscale data centers, following an executive order signed July 14 by Gov. Kathy Hochul. 

Delta Electronics (Americas) and X LABS Sign Technology Partnership MOU to Power Next-Gen AI Data Centers

07/15/2026 | Delta Electronics
Delta Electronics announced a Memorandum of Understanding (MOU) with X LABS, an investment manager and developer of islanded grids, to deliver energy-as-a-service (EaaS) to AI data center projects.

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.

Below the Surface: Ceramic vs PCB: When ‘Good Enough’ Becomes System Failure

07/15/2026 | Chandra Gupta -- Column: Below the Surface
Let’s start with the question engineers are increasingly asking themselves: “When should I use ceramic instead of FR-4?” It’s a fair question. FR-4 has been the backbone of electronics for decades. It’s affordable, widely available, and for many applications, it works just fine. Until it doesn’t.

Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in