Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/23/2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.

Acumentrics Partners with Trilogic Systems to Expand Northeast Presence

07/22/2026 | BUSINESS WIRE
This partnership advances Acumentrics’ expansion in the Northeastern United States, delivering customers enhanced accessibility, technical support, and application expertise for rugged power systems in demanding environments.

EU Clears €659 Million for German Semiconductor Expansion

07/21/2026 | I-Connect007 Editorial Team
The European Commission has approved €659 million in German state aid for four semiconductor manufacturing projects, continuing Europe's broader effort to strengthen regional semiconductor production and reduce dependence on overseas suppliers.

Hitachi Energy, Eve Air Mobility Accelerate Electrification Infrastructure for Urban Air Mobility

07/17/2026 | Hitachi Energy
Hitachi Energy, a global technology leader in electrification, and Eve Air Mobility, an Embraer-backed electric vertical takeoff and landing (eVTOL) aircraft manufacturer, have signed a Memorandum of Understanding to advance the electrical infrastructure needed to support urban air mobility at scale.

Infineon, LS ELECTRIC Team Up on DC Power Solutions for AI Data Centers

07/16/2026 | Infineon
Infineon Technologies AG and LS ELECTRIC have signed a Memorandum of Understanding (MoU) to collaborate on high-efficiency direct current (DC) power infrastructure solutions for AI data centers and next-generation power grids.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in