Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Knocking Down the Bone Pile: X-ray Inspection of Ball Grid Array Solder Joints

08/07/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) devices are ubiquitous in electronic products primarily due to their advantages, including compact packaging, greater durability than leaded devices, and improved performance from shorter signal paths. BGAs improve electrical performance by reducing inductance and capacitance between the internal silicon die and the PCB, resulting in superior signal integrity and faster operation speeds. BGAs also offer superior thermal performance by dissipating heat more effectively, reducing the risk of overheating.

Siemens Launches SIMATIC AX WinCC Unified Elements

07/31/2026 | Siemens
Siemens—a global leader in industrial AI and automation technology—announced the launch of SIMATIC AX WinCC Unified Elements, an IT-like engineering application for the SIMATIC WinCC Unified system.

Synopsys Showcases Autonomous Engineering with NVIDIA

07/28/2026 | PRNewswire
At the 2026 DAC Chips to Systems Conference, Synopsys, Inc. announced advancements to agentic AI for engineering in collaboration with NVIDIA.

Kurtz Ersa Partners with E-tronix for Sales in Illinois and Wisconsin

07/23/2026 | Kurtz Ersa
Kurtz Ersa Inc., a leading supplier of electronics production equipment, has entered into a new representative agreement with E-tronix to support customers in Illinois and Wisconsin. Under the agreement, E-tronix will provide sales support for Kurtz Ersa’s soldering, reflow, and rework equipment across the region.

Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation

06/17/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced that it completed the acquisition of VPIphotonics on June 9, 2026, adding system-level simulation to its photonic design automation portfolio and enabling optical and electrical engineers to advance designs from component to complete link within a single environment.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in