Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Keiron Printing Technologies Raises €20.7M to Revolutionize LiFT Precision Solder Paste Printing for High-Reliability Electronics

07/22/2026 | Keiron Printing Technologies
Keiron Printing Technologies, the pioneer of Laser-Induced Forward Transfer (LiFT) precision solder paste printing, today announced it has closed a €20.7 million Series A round to end one of electronics manufacturing’s most expensive, unsolved problems – for good.

Federal Electronics Expands Advanced Manufacturing for Military and Aerospace Cable and Wire Harness Programs

07/22/2026 | Federal Electronics
Federal Electronics, a leading provider of high-reliability electronic manufacturing services (EMS), has expanded its cable assembly and wire harness manufacturing capabilities and production capacity to support the growing needs of military, defense, and aerospace OEMs.

From Prototype to Product: Why E-Textile Standards Matter

07/22/2026 | Chris Jorgensen, Global Electronics Association
Imagine a neonatal monitoring wrap used in a hospital to track an infant’s vital signs during transport between units. It looks and feels like a soft textile. But embedded within it are conductive pathways, sensors, interconnections and electronics that must perform in a critical moment. If the product fails, the issue is not simply a garment defect or an electronics defect. It could affect clinical decision-making. That is what makes e-textiles so promising and so challenging.

Cicor Reports Strong H1 Orders, Returns to Organic Growth in Q2

07/22/2026 | Cicor
Cicor Group achieved strong growth in revenue and orders in the first half, while profitability and cash conversion reflected the ongoing integration phase and supply chain challenges.

EU Clears €659 Million for German Semiconductor Expansion

07/21/2026 | I-Connect007 Editorial Team
The European Commission has approved €659 million in German state aid for four semiconductor manufacturing projects, continuing Europe's broader effort to strengthen regional semiconductor production and reduce dependence on overseas suppliers.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in