Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

NHanced Semiconductors & University of Florida to Present on Advanced Packaging for Photonics at the 2026 SMTAI Conference

08/24/2026 | NHanced Semiconductors
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors vice-president Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

NHanced Semiconductors, UF to Present Advanced Photonics Packaging at SMTAI 2026

08/18/2026 | PRNewswire
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

GlobalFoundries Reports Q2 2026 Revenue of $1.79B

08/11/2026 | GlobalFoundries
GLOBALFOUNDRIES Inc. (GF)  announced preliminary financial results for the second quarter ended June 30, 2026.

Sila Gets Conditional $1.4B U.S. Department of War Loan for Battery Manufacturing

08/10/2026 | BUSINESS WIRE
Sila, an advanced battery technology company, announced that it has received a conditional loan commitment of up to $1.4 billion from the United States Department of War through its Office of Strategic Capital (OSC).

Foxconn Research Develops 34.1 Tbps Silicon Photonics Technology

07/30/2026 | Foxconn
Foxconn Research Institute, in collaboration with National Yang Ming Chiao Tung University, has developed a 34.132 Tbps ultra-high-capacity silicon photonics transmission technology designed to address growing data bandwidth demands driven by artificial intelligence (AI).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in