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Intel to Acquire Classiq to Create a Full-stack Quantum Computing Platform

10/28/2026 | Intel
 Intel Corporation announced that it has entered into a definitive agreement to acquire Classiq, a leading provider of quantum computing software. The combination of Classiq’s synthesis platform with Intel’s spin-qubit manufacturing and existing software would create a user-friendly full-stack quantum computing platform, enabling the promising technology to mature into a mainstream computing business.

SEMI Forecasts 11.8% Growth in Silicon Wafer Shipments in 2026

10/22/2026 | TrendForce
Global silicon wafer shipments are projected to increase 11.8% in 2026 to 14,420 million square inches (MSI), SEMI reported in its annual silicon shipment forecast. Shipments are expected to reach successive record highs from 2027 through 2029, rising to 17,034 MSI by the end of the forecast period. 

Scale-Up: From Monolithic Silicon to Advanced Packaging

10/15/2026 | Chetan Arvind Patil, Marvell Technology
This is the first in a three-part series exploring scale-up, scale-out, and scale-across in advanced packaging. Scale-up focuses on increasing compute capability, memory capacity, and communication bandwidth within tightly integrated computing systems. Scale-out expands computing capacity by connecting multiple servers, compute nodes, and racks through high-speed networks. Scale-across focuses on integrating and coordinating diverse computing resources, technologies, and workloads across data centers to improve overall efficiency and resource utilization.

eInfochips Showcases End-to-End ASIC Design Capabilities

10/13/2026 | PRNewswire
eInfochips, an Arrow Electronics company and provider of semiconductor and product engineering services, announced that it has successfully demonstrated end-to-end turnkey ASICdesign capability through the development, fabrication, packaging, and bring-up of a test chip.

CScale Exits Stealth With $145M to Build AI Interconnects

09/30/2026 | BUSINESS WIRE
CScale exited stealth, announcing $145 million in Series C funding to accelerate development and commercialization of optical interconnect for AI scale-up, the high-bandwidth, ultra-low-latency connections that let accelerators work together like a single, much larger computer.
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