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As a leading provider of high-reliability soldering and sintering materials for power electronics devices, Indium Corporation experts will share new research and insights on these two core industry product solutions at the International Conference on Electronics Packaging Technology (ICEPT) 2026, August 5-7, in Xi’an, China.
August 6, 13:00-13:25 CST – A Review of a Bi-Free In-Containing Lead-Free Mid-Temperature Solder, presented by Hongwen Zhang, Ph.D., Research and Development Director and Principal Metallurgist.
By eliminating brittle bismuth-rich phases, Indium Corporation’s Durafuse® LT solder delivers at least two orders of magnitude improvement in drop shock resistance and significantly reduced electromigration rates—performance comparable to or exceeding SAC305. The session will also show how Durafuse® LT’s lower reflow temperatures reduce warpage-related defects in large-format BGA packages, establishing it as a high-reliability platform for next-generation electronics assembly.
August 6, time TBD – Pressure Cu Sintering Paste Developed for Next-Generation Interconnection Material, presented by Mary Li Ma, Senior Research Chemist.
This presentation introduces a next-generation copper sintering paste developed for high-power semiconductor applications. It will demonstrate how the material delivers high reliability, excellent thermal and electrical performance, and strong bonding without requiring gold or silver plating. The session also explores advances in oxidation resistance, extending shelf life, and processing flexibility that make this novel paste a promising die-attach solution for power electronics.
