Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

DOCOMO, Samsung Electronics Achieves Successful Validation of User-level AI-RAN Technology

08/10/2026 | JCN Newswire
NTT DOCOMO, INC. and Samsung Electronics announced that they have successfully validated AI-based radio access network (AI-RAN) optimization technology at the user level.

Molex Launches MiniMix Connectors for Humanoid Robotics

08/06/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid robotics, autonomous mobile robots (AMRs) and advanced industrial automation systems.

NextNav, Safran Demonstrate 5G PNT Interoperability

07/31/2026 | BUSINESS WIRE
NextNav Inc., a leader in next-generation terrestrial Positioning, Navigation, and Timing (PNT) and 3D geolocation solutions, announced an agreement with Safran Electronics & Defense to integrate and demonstrate interoperability between NextNav's terrestrial 5G Positioning, Navigation, and Timing (PNT) network in Santa Clara County, California, and Safran’s timing and navigation receiver.

OptiMIM Announces Official Opening of OptiMIM Global Manufacturing Facility in India

07/23/2026 | PRNewswire
OptiMIM, a Form Technologies company, announces the official opening of the OptiMIM Global manufacturing facility in India, marking a significant milestone in the company's continued global expansion and regional manufacturing strategy.

Ionic Contamination Debate Highlights Growing Divide in Automotive Electronics

07/15/2026 | I-Connect007 Editorial Team
A recent Global Electronics Association panel discussion revealed both broad agreement and sharp differences regarding one of electronics manufacturing’s most persistent reliability questions: How clean is clean enough? The discussion, focused on ionic contamination assessment in electronic control unit (ECU) manufacturing, brought together the following experts:  Tim Dietz from Ford Motor Company, Dr. Lothar Henneken from Robert Bosch, Eric Camden from Foresite, Hubertus Mertens from MKS’ Atotech, Doug Pauls from It Depends Electronics, and Stan Rak from SF Rak Company, as moderator. While everyone agreed that contamination control is essential for long-term reliability, panelists differed significantly on whether ion chromatography (IC) should play a larger role in production acceptance and process control.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in