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IC-Link by imec Expands TSMC Collaboration for Advanced-Node Chip Design

10/01/2026 | Imec
IC-Link by imec, imec’s design and manufacturing service provider for ASICs and silicon photonics, and TSMC announced an expansion of their collaboration aimed at simplifying customer access to advanced-node semiconductor design capabilities.

Zhen Ding Prices $800M Overseas Convertible Bonds

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REPORT: Closing the European Gap in Data Centre, Cloud, and AI Infrastructure Manufacturing

09/17/2026 | Global Electronics Association
The Global Electronics Association released From Chips to Systems: Building an End-to-End EU Strategy for Data Centre, Cloud Infrastructure and AI, a joint report with DECISION Études & Conseil. Europe is one of the world’s three largest markets for AI data centres.

HUMAIN, Compal Partner to Expand Cloud-to-Edge AI at LEAP 2026

09/01/2026 | Compal Electronics Inc.
As artificial intelligence rapidly expands beyond centralized cloud computing into real-world applications, HUMAIN has selected Compal Electronics as its long-term strategic ODM partner to support the development and manufacturing of its next-generation AI infrastructure and intelligent computing platforms.

India’s Enterprise Infrastructure Market Surges 30% on AI and Component Costs

08/26/2026 | IDC
According to IDC’s Worldwide Quarterly Enterprise Infrastructure Tracker, India’s enterprise infrastructure market reached US$1.67 billion in the first quarter of 2026, up from US$1.28 billion a year earlier.
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