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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Intel, Oracle Expand Collaboration for Enterprise and Agentic AI on OCI

10/30/2026 | Intel
Intel and Oracle announced plans for a multiyear collaboration intended to expand Intel® Xeon®-based computing on Oracle Cloud Infrastructure (OCI).

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08/14/2026 | IBM
IBM announced a collaboration with Together AI to deliver IBM and NVIDIA AI infrastructure. Under a multi-year $240M agreement between IBM and Together AI, IBM is positioned to deploy a large cluster of NVIDIA HGX B300 systems on IBM Cloud with expected availability in Q1 2027.

Compal, Datasection Advance AI Infrastructure for the Production Era

06/03/2026 | Compal Electronics Inc.
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The shift in AI development from large-scale model training toward inference-centric Agentic AI applications is driving a structural expansion in memory demand, according to TrendForce's latest findings on the memory industry.

Compal, GMI Cloud Announce Collaboration on AI Infrastructure Development

05/28/2026 | PRNewswire
Compal Electronics Inc. announced its collaboration with GMI Cloud, a Silicon Valley-based AI infrastructure provider, to advance the deployment of next-generation AI infrastructure optimized for large-scale inference and emerging agentic AI workloads.
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