Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Beyond Design: Inductance—The Silent Architect Driving SI and PI

11/11/2026 | Barry Olney -- Column: Beyond Design
Inductance is the quiet saboteur of high speed design. It doesn’t reveal itself the way impedance discontinuities do, nor does it leave the obvious clues that poor routing or inadequate stackups produce. Yet it shapes nearly every facet of signal integrity (SI) and power integrity (PI), influencing how energy moves, how noise couples, how timing shifts, and how the power distribution network (PDN) responds under dynamic load.

Siemens Expands NVIDIA AI Collaboration for 3D IC Power and Thermal Challenges

10/27/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.

Cadence Unveils Maestro AI Model Portfolio to Advance Agentic Chip and System Design

10/26/2026 | Cadence Design Systems
Cadence announced the Maestro™ AI Model Portfolio, which powers Cadence® AI Super Agents across semiconductor and system design workflows.

EDA Market to Reach $34.5B by 2033 on AI and Cloud Growth

10/15/2026 | Globe Newswire
The global Electronic Design Automation (EDA) market is positioned for substantial growth as semiconductor manufacturers and electronics companies address increasingly complex product designs.

Siemens, TSMC Advance AI-powered Semiconductor Design Automation

09/24/2026 | Siemens
Siemens announced continued collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in