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I-Connect007 announces the release of the fifth episode in its six-part podcast series, On the Line With… Qnity: Engineering What’s Next. This latest installment, titled “Engineering Heat Out of High-Power Systems,” examines the increasingly critical role of thermal management in electronics design and how innovative materials are enabling higher performance, greater reliability, and improved safety.
The rapid growth of AI data centers, electric vehicles, energy storage systems, and advanced consumer electronics is driving power densities to new heights, making thermal management a critical engineering challenge. Managing heat can no longer be an afterthought; it must be a fundamental consideration in system architecture from the earliest stages of design.
In this episode, I-Connect007's Marcy LaRont speaks with Shih-Wei Chang, global business development leader, CE and telecom, about the evolving role of printed circuit boards in thermal management and why heat generated by one component can affect the performance and reliability of an entire system.
The conversation explores how advanced materials are helping engineers balance thermal conductivity, electrical insulation, safety, and long-term reliability in increasingly demanding applications. Chang also emphasizes the importance of collaboration among designers, manufacturers, and materials suppliers to develop more effective thermal solutions.
As electronics become smaller, more powerful, and more complex, the episode offers valuable insight into why a system-level approach to thermal management is essential to engineering the next generation of high-performance electronics.
Listen to “Engineering Heat Out of High-Power Systems” and explore the complete On the Line With… Qnity: Engineering What’s Next podcast series in the I-Connect007 Podcast Library.
Listeners can also download the free Companion Guide to Engineering What’s Next, which expands on the technologies, materials, and engineering challenges explored throughout the series.
About I-Connect007
I-Connect007 is a leading source of news, technical information, and educational resources for the global electronics manufacturing industry. Through its digital magazines, newsletters, podcasts, books, and other platforms, I-Connect007 connects industry professionals with the insights and expertise shaping the future of electronics design, fabrication, assembly, and advanced packaging.
