Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

STMicroelectronics Unveils Advanced MCUs for AI Data Centers and Robotics

11/05/2026 | Globe Newswire
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed the new STM32G5 series of mixed-signal microcontrollers (MCUs).

MacDermid Alpha to Showcase SiC Power Module Technology at electronica 2026

11/03/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will exhibit at electronica 2026 (November 10–13, Messe München, Booth C2.654), showcasing its upcoming BondPad technology, an Argomax® film-laminated copper-foil solution for sintered die-topside attach in high-power, high-reliability silicon carbide (SiC) packages.

TI Marks 70 Years of Innovation in Europe

11/03/2026 | PRNewswire
Texas Instruments (TI) is celebrating 70 years of operations in Europe, demonstrating its long history of semiconductor innovation, research and development, manufacturing and customer partnership in the region.

onsemi to Acquire Ferric

11/03/2026 | onsemi
onsemi announced that it has entered into an agreement to acquire Ferric, Inc., an innovator in integrated voltage regulator (IVR) technology, for $600 million in cash, plus up to $175 million in contingent consideration upon achievement of certain revenue milestones.

TECO, Foxconn Showcase NVIDIA-Based Modular Data Center

11/02/2026 | Foxconn
Teco Electric participated in Foxconn Technology Day for the second time, focusing on its Modular Data Center (MDC ) concept developed in cooperation with Foxconn. The MDC is based on the NVIDIA DSX POD reference design.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in