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Amkor marked a new milestone in South Korea with a groundbreaking at in Gwangju. The expansion is the next phase of growth for a site that has been part of Amkor’s Korea operations since the 1990s, and it supports rising demand for advanced packaging in AI and accelerated computing.
A Foundation for Growth
Amkor’s Gwangju campus has approximately 152,000 square meters of manufacturing space, with capabilities that include wafer bumping, Flip Chip BGA (FCBGA), Flip Chip CSP (fcCSP), System in Package (SiP), Wafer-level Packaging (WLP) and test. The new building adds capacity to serve the next generation of computing platforms.
The groundbreaking comes as Amkor announces additional investments to expand capacity in South Korea, alongside its expanded collaboration with NVIDIA. Across its operations in Arizona and South Korea, Amkor has now announced multi-year agreements totaling over $3 billion.
Expanding Across South Korea
The growth in Gwangju adds to Amkor’s broader footprint in South Korea. That includes expansion in Songdo, which is home to Amkor’s Global Research and Development Center. The Songdo campus supports advanced packaging technologies such as high-density fan-out (HDFO), 2.5D TSV, FCBGA and SiP, along with wafer bumping, probe and final test.
Celebrating with Partners
Amkor was joined at the groundbreaking by Amit Nagra, vice president of Chip Supply Chain and general manager of Co-Packaged Optics (CPO) Manufacturing at NVIDIA. Amit also toured the Songdo and Gwangju facilities with Amkor Korea leaders during his visit.
Building What Comes Next
Advanced packaging makes possible the performance, power efficiency and integration that next-generation AI systems need. With the South Korea expansion underway, Amkor continues to build the capacity, technology and talent to support its customers’ long-term growth.
