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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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CES 2015: Preview and Predictions
January 5, 2015 | Dan Feinberg, FeinLine Associates, Inc.Estimated reading time: 3 minutes
Stay tuned as I will be providing many pictures and comments on what I see daily at CES 2015.
Page 2 of 2Suggested Items
Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
11/26/2024 | John Watson -- Column: Elementary, Mr. WatsonThe infamous "rules of thumb" are simple guidelines that help you make decisions based on experience, not exact facts. They’re like shortcuts we use because they work most of the time. For example, if you want to know if spaghetti is done cooking, a common rule of thumb is to grab a spaghetti strand and throw it against the wall to see if it sticks. I used to do that, except that instead of the wall, I used the ceiling, which drove my mother crazy.
Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
Nano Dimension Unveils 3D Printer for Micro Applications at Formnext
11/19/2024 | Nano DimensionNano Dimension, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announces the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications. Developed to enable the creation of superior resolution micro parts at high production throughput, the high-speed Exa was unveiled today for the first time globally at Formnext in Frankfurt, Germany (Hall 11, Stand D22).
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.