-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Cadence’s Brad Griffin Digs Deep Into DDR
February 22, 2015 | Kelly Dack, I-Connect007Estimated reading time: 12 minutes
Guest Editor Kelly Dack stopped by the Cadence Design Systems booth at DesignCon 2015, where he sat down with Product Marketing Manager Brad Griffin to discuss Cadence’s advanced PCB design and signal integrity tools, and the company’s focus on DDR.
Kelly Dack: Brad, since you’re the product marketing director for Cadence Design Systems, I’d like to ask a few questions about your DDR products. But first, please give us a brief overview of DDR.
Brad Griffin: I’d be happy to. One of the main things with a computer is that it has memory and you can store data in that memory—that’s kind of what makes it a computing device. So they’ve been finding ways over the life of electronics to store and retrieve data faster out of memory. Somewhere around 2002, we came up with this idea of doubling the data rate in DDR memory, or double data rate memory. That was unique because basically, we clocked the data into the memory, both on the rising edge and on the falling edge of the clock. It was a clever way with the same sort of signaling to basically double the data rate speeds.
KD: Was there an organization involved? Was it standardized?
BG: That’s really good question. As of right now, there's a standard committee called JEDEC, and I'm going to assume they were in place back in the 2002 timeframe, but I’d have to go back and check. But obviously there's memory companies and they have to be able to plug-and-play with different controllers as they’re driving the memory, so there's probably always been a standard they’ve been marching toward. That process used to be a lot simpler. You’d be transferring data at maybe 100 megabits per second. You would send the data, clock it in, and it wasn’t nearly as complicated as it is now.
KD: So where has DDR come from, and where is it now?
BG: There was DDR2 and then DDR3, and probably 2015 is going to be the transition where most DDR3 designs go over to DDR4. Typically, this happens because the DDR4 memory will actually become less expensive than some of the DDR3 memory.
KD: What does that mean as far as the technology from a power standpoint as well as a data standpoint?
BG: The main difference from a technology standpoint from DDR3 to DDR4 is the speed. It basically just gets faster. So any application you have in the computer that’s run with DDR4 memory will make for a faster computer than one running with DDR3. One of the exciting things that has migrated probably over the last five to seven years is this new version of DDR called LPDDR, which stands for low power. That’s been something primarily used in mobile devices because you certainly don’t want your cell phone to run out of power in the middle of the day.
KD: With this reference to power, if I understand correctly, DDR came from a 2.5 V system and shrunk to 1.8 V and 1.5 V, and DDR4 is down at a little over 1 V. That seems really low already, so where will the LPDDR take us?
BG: If you can believe it, the LPDDR4 specification only has a 300 mV swing, so it's really low. That means that for signal integrity and power integrity engineers, there's really very little margin left. We said there was very little margin left when it was 1.5 V, and now we’re down to 300 mV; this very small swing of data means that your signals have to be clean and your power planes have to basically be stable. Because then you have to have a power/ground bounce associated with simultaneous switching signals. It’s going to basically make it so that you're not going to meet the signal quality requirements that JEDEC puts in place for LPDDR4. So designs are getting really interesting. What we’re excited about this year at DesignCon are the things we’ve been putting into our tools to enable designers to validate that they've done everything they need to do to meet the LPDDR4 requirements.
Page 1 of 3
Suggested Items
SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium
11/26/2024 | SMTAThe SMTA is excited to announce the technical program for the 2nd annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.
Hon Hai Research Institute, Yangming Jiaotong University Jointly Won the Future Technology Award
11/26/2024 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), a subsidiary of Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, joins hands with National Yang -Ming Chiao Tung University ( NYCU ) to break through space Computing Extreme stood out at the " 2024 Taiwan Innovation Technology Expo" and won the "Future Technology Award" for its innovative technology of "application of all-gallium arsenide super interface holography in structured light and stereoscopic vision".
Plasmatreat Expands its International Network and Opens a Subsidiary in Mexico
11/26/2024 | PlasmatreatOn-site sales, consulting, application engineering and service for local companies and global corporations based in Mexico: Plasmatreat GmbH has opened another branch in Querétaro, Mexico, to provide even better and more direct support to users and interested parties of atmospheric pressure plasma technology. Plasmatreat continues to expand its international network.
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.