Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Cadence Unveils Maestro AI Model Portfolio to Advance Agentic Chip and System Design

10/26/2026 | Cadence Design Systems
Cadence announced the Maestro™ AI Model Portfolio, which powers Cadence® AI Super Agents across semiconductor and system design workflows.

Qnity Advances Interconnect Innovations for Next-Generation Smart Consumer Electronics

10/22/2026 | Qnity
Qnity Electronics, Inc. introduces ultra-thin flex circuit materials that help enable the next generation of smart consumer electronics, including smartphones, AI glasses, and AR/VR devices, through advanced materials innovations that deliver exceptional bendability, mechanical performance, and reliability for advanced interconnect applications.

Arda Emerges from Stealth to Speed Up American Manufacturing

10/21/2026 | BUSINESS WIRE
Arda Industries launched from stealth with $232 million in funding to speed up American manufacturing.

Siemens, NVIDIA Expand Agentic AI Collaboration for 3D IC Power and Thermal Design

10/21/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.

Cadence InnoStack AI Agent Supports Socionext’s 3nm SoC Design

10/21/2026 | Cadence Design Systems
 Socionext Inc., a global leader in custom SoC design and development, is actively advancing its SoC design and development capabilities through agentic AI and expanding the application of AI-driven design to the physical design of large-scale system-on-chip (SoCs) using advanced process technologies.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in