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MacDermid Alpha Showcases Advanced Soldering Materials for High-Reliability Electronics Assembly at NEPCON Thailand 2026

06/11/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will present its latest materials technologies at NEPCON Thailand 2026, held June 17 to 20 at the Bangkok International Trade & Exhibition Centre (BITEC), Thailand. Recognized as a premier gathering for technology leaders and manufacturers, the event supports one of the world’s most dynamic electronics manufacturing regions.

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

06/08/2026 | Michael Carano -- Column: Trouble in Your Tank
Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.

Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4

06/04/2026 | Anaya Vardya, American Standard Circuits
Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?

SMT007 Magazine June Issue Focuses on Cleaning, Contamination Control, and Reliability

06/02/2026 | I-Connect007 Editorial Team
SMT007 Magazine’s June issue examines how cleaning processes, contamination control, and reliability engineering are evolving to support highly dense assemblies, advanced packaging, and next-generation electronics manufacturing.

KOKI to Highlight E-Series Zero Flux Residue Solder Paste at PCIM Europe 2026

05/22/2026 | KOKI
KOKI Company Ltd., a global leader in advanced soldering materials, will showcase its E-Series solder paste at PCIM Europe 2026 in Nuremberg, Germany, exhibiting in Hall 6, Booth 345, and bringing a focused solution to the evolving demands of power semiconductor manufacturing.
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