-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Amundson Launches Arkeo Stack and Arkeo Panel
July 8, 2015 | Amundson TechnologiesEstimated reading time: 2 minutes
James Amundson, electronics industry veteran of over 15 years is pleased to announce the launch of Arkeo Stack, an advanced PCB stack-up modeling software, focused on rigid, flex, rigid-flex and IMS PCBs stack-up solutions, targeting design engineers to PCB manufacturers. “Today’s electronics OEM, EMS and PCB companies are challenged in sourcing a cost effective, accurate, intuitive PCB stack-up software that will accommodate, simple to complex interconnect structures and all PCB design types. We believe we have a solution." Amundson Technologies partnered with PCB Companies and industry experts to design a solution to meet and exceed their stack up needs. "We solicited feedback from multiple Front End Engineers, Application Engineers and facility managers, from both rigid and flex PCB manufacturers, in developing Arkeo Stack." Mr. Amundson said.
To list a few of Arkeo stacks features:
- Rigid and Rigid-Flex modeling: Accurately model any number of rigid and flex zones, you can model any build no matter how complex. Accurately model impedance on any section of the build.
- Complex Interconnect Structures: Accurately model and display; mechanical vs laser vias, filled vs unfilled, stacked vs staggered, and consider copper thickness requirements for copper wrap.
- Accurate and Configurable: Materials are configured to facility thicknesses and specifications, making press thicknesses and impedance very accurate. All aspects of the system are configurable to facility or user needs.
- Impedance Calculations: Impedance calculations are generated using Apsim Rlgc for the most accurate predictions. Includes the ability to model structures with crosshatch reference planes.
- Back Calculation: System will automatically back calculate build dielectric thickness and/or line width given specific impedance requirements.
- Electrical Properties; Automatic calculations of individual layer Dk/Df for more accurate impedance predictions.
- Easy to use interface: The interface is very intuitive and easy to use, allowing users to master the software without a long learning curve.
- BOM generation: Bill of Materials with panel specific costs can be generated to view or input into most quotation packages.
- Customizable Reports: Reports are fully customizable allowing you to use your company's logo and display in the format of your choice. Multiple reports can be configured allowing users to have the output they need. Reports can be printed or saved directly to Pdf.
- Panelization: Built-in panelization layout tool. Layout panels with individual boards or arrays, add coupons, rails, etc. Arrays can be layed-out by fixed array size or by a matrix of boards. Full dimensions can be added to the array.
- "Industry feedback has been extremely positive." Amundson continued, "A Tier One OEM benchmarked our product against existing software systems in 2014. The results from their engineering staff gave Arkeo Stack the best report. We now have multiple installations in the US and Canada."
More information on Arkeo Stack can be found at www.arkeostack.com.
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.