-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Amundson Launches Arkeo Stack and Arkeo Panel
July 8, 2015 | Amundson TechnologiesEstimated reading time: 2 minutes

James Amundson, electronics industry veteran of over 15 years is pleased to announce the launch of Arkeo Stack, an advanced PCB stack-up modeling software, focused on rigid, flex, rigid-flex and IMS PCBs stack-up solutions, targeting design engineers to PCB manufacturers. “Today’s electronics OEM, EMS and PCB companies are challenged in sourcing a cost effective, accurate, intuitive PCB stack-up software that will accommodate, simple to complex interconnect structures and all PCB design types. We believe we have a solution." Amundson Technologies partnered with PCB Companies and industry experts to design a solution to meet and exceed their stack up needs. "We solicited feedback from multiple Front End Engineers, Application Engineers and facility managers, from both rigid and flex PCB manufacturers, in developing Arkeo Stack." Mr. Amundson said.
To list a few of Arkeo stacks features:
- Rigid and Rigid-Flex modeling: Accurately model any number of rigid and flex zones, you can model any build no matter how complex. Accurately model impedance on any section of the build.
- Complex Interconnect Structures: Accurately model and display; mechanical vs laser vias, filled vs unfilled, stacked vs staggered, and consider copper thickness requirements for copper wrap.
- Accurate and Configurable: Materials are configured to facility thicknesses and specifications, making press thicknesses and impedance very accurate. All aspects of the system are configurable to facility or user needs.
- Impedance Calculations: Impedance calculations are generated using Apsim Rlgc for the most accurate predictions. Includes the ability to model structures with crosshatch reference planes.
- Back Calculation: System will automatically back calculate build dielectric thickness and/or line width given specific impedance requirements.
- Electrical Properties; Automatic calculations of individual layer Dk/Df for more accurate impedance predictions.
- Easy to use interface: The interface is very intuitive and easy to use, allowing users to master the software without a long learning curve.
- BOM generation: Bill of Materials with panel specific costs can be generated to view or input into most quotation packages.
- Customizable Reports: Reports are fully customizable allowing you to use your company's logo and display in the format of your choice. Multiple reports can be configured allowing users to have the output they need. Reports can be printed or saved directly to Pdf.
- Panelization: Built-in panelization layout tool. Layout panels with individual boards or arrays, add coupons, rails, etc. Arrays can be layed-out by fixed array size or by a matrix of boards. Full dimensions can be added to the array.
- "Industry feedback has been extremely positive." Amundson continued, "A Tier One OEM benchmarked our product against existing software systems in 2014. The results from their engineering staff gave Arkeo Stack the best report. We now have multiple installations in the US and Canada."
More information on Arkeo Stack can be found at www.arkeostack.com.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.
The Chemical Connection: Surface Finishes for PCBs
03/31/2025 | Don Ball -- Column: The Chemical ConnectionWriting about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.
NUS Physicists Discover a Copper-free High-temperature Superconducting Oxide
03/28/2025 | PRNewswireProfessor Ariando and Dr Stephen Lin Er Chow from the National University of Singapore (NUS) Department of Physics have designed and synthesised a groundbreaking new material—a copper-free superconducting oxide—capable of superconducting at approximately 40 Kelvin (K), or about minus 233 degrees Celsius (deg C), under ambient pressure.
AT&S Sets New Standards in the Recycling of Copper and Chemicals
03/25/2025 | AT&SAT&S has been working for years to reduce the ecological footprint of its production sites worldwide with a comprehensive sustainability strategy and considerable investments.
Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
03/24/2025 | DuPontDuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.