-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Amundson Launches Arkeo Stack and Arkeo Panel
July 8, 2015 | Amundson TechnologiesEstimated reading time: 2 minutes
James Amundson, electronics industry veteran of over 15 years is pleased to announce the launch of Arkeo Stack, an advanced PCB stack-up modeling software, focused on rigid, flex, rigid-flex and IMS PCBs stack-up solutions, targeting design engineers to PCB manufacturers. “Today’s electronics OEM, EMS and PCB companies are challenged in sourcing a cost effective, accurate, intuitive PCB stack-up software that will accommodate, simple to complex interconnect structures and all PCB design types. We believe we have a solution." Amundson Technologies partnered with PCB Companies and industry experts to design a solution to meet and exceed their stack up needs. "We solicited feedback from multiple Front End Engineers, Application Engineers and facility managers, from both rigid and flex PCB manufacturers, in developing Arkeo Stack." Mr. Amundson said.
To list a few of Arkeo stacks features:
- Rigid and Rigid-Flex modeling: Accurately model any number of rigid and flex zones, you can model any build no matter how complex. Accurately model impedance on any section of the build.
- Complex Interconnect Structures: Accurately model and display; mechanical vs laser vias, filled vs unfilled, stacked vs staggered, and consider copper thickness requirements for copper wrap.
- Accurate and Configurable: Materials are configured to facility thicknesses and specifications, making press thicknesses and impedance very accurate. All aspects of the system are configurable to facility or user needs.
- Impedance Calculations: Impedance calculations are generated using Apsim Rlgc for the most accurate predictions. Includes the ability to model structures with crosshatch reference planes.
- Back Calculation: System will automatically back calculate build dielectric thickness and/or line width given specific impedance requirements.
- Electrical Properties; Automatic calculations of individual layer Dk/Df for more accurate impedance predictions.
- Easy to use interface: The interface is very intuitive and easy to use, allowing users to master the software without a long learning curve.
- BOM generation: Bill of Materials with panel specific costs can be generated to view or input into most quotation packages.
- Customizable Reports: Reports are fully customizable allowing you to use your company's logo and display in the format of your choice. Multiple reports can be configured allowing users to have the output they need. Reports can be printed or saved directly to Pdf.
- Panelization: Built-in panelization layout tool. Layout panels with individual boards or arrays, add coupons, rails, etc. Arrays can be layed-out by fixed array size or by a matrix of boards. Full dimensions can be added to the array.
- "Industry feedback has been extremely positive." Amundson continued, "A Tier One OEM benchmarked our product against existing software systems in 2014. The results from their engineering staff gave Arkeo Stack the best report. We now have multiple installations in the US and Canada."
More information on Arkeo Stack can be found at www.arkeostack.com.
Suggested Items
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.