-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
DownStream Releases New Versions of Industry-Leading Products
July 16, 2015 | DownStream Technologies, LLCEstimated reading time: 6 minutes
DownStream Technologies, LLC today announced the release of new versions of their industry-leading PCB post-processing solutions, BluePrint-PCB, CAM350, and DFMStream. The releases include many new features and performance improvements designed to help users post-process PCB designs and create and distribute all the deliverables required for a complete PCB assembly release package.
“We are very involved with our customer base so throughout the year we query them and look for feedback on how to improve our products,” said Rick Almeida, one of DownStream’s founders. “Based on that input, we have responded with new releases which include significant additions and enhancements,” he added.
Among the major enhancements is a new graphic user interface (GUI) for BluePrint-PCB which has been updated to align with Microsoft Ribbons User Interface scheme. The new “ribbons interface” flattens out BluePrint’s menu hierarchy, making access to common functions faster and easier. The additions include a new dynamic “World View” to give users a quick reference of the current screen location as well as an optional new “Pan and Zoom” function that aligns BluePrint’s viewing functions with most PCB CAD tools. The pan and Zoom function uses the middle mouse button to quickly zoom in and out of large sheet-sized documents. The new Panning function allows users to quickly pan across the drawing sheet either while viewing or while executing other drawing commands. The user interface enhancements borrow many design ques from DownStream’s SoloPCB® design tools and signal a new direction for all DownStream products going forward.
“During the development of our Do-It-Yourself PCB design tools - SoloPCB and SoloCapture® - we created a new user interface model. Those same concepts have allowed us to seamlessly create a new user interface paradigm for BluePrint-PCB, keeping it aligned with other Microsoft Office document applications,” Almeida said. “We see the Microsoft Ribbons model becoming the standard GUI platform for all DownStream products going forward,” he hinted.
In addition to the new user interface, major modifications were made to BluePrint’s Assembly Panel functions allowing users to design assembly panels in a more user-friendly design environment. When a panel design is executed, BluePrint’s document view is replaced by an easier-to-view design view that allows color-coding of different panel objects. The result is a seamless transition between design editing and document editing.
Several new features were also added to BluePrint’s Assembly Panel Toolkit. Features such as Smart Callouts that automatically detect pinning holes and board chamfer and automatically calculates the number of instances these features are used in the design to minimize PCB fabrication errors. At the same time new online Mill Checking features have been added that prevent users from placing mill tabs too close to other mill tabs or PCB features saving time and increasing panel manufacturability.
DFMStream has also seen significant upgrades in this release. Specifically, DFMStream had been updated to include new Analysis Checks to verify anti-pads to adjacent layers to validate 100% ground plane reference and same net minimal spacing. Negative Planes were further expanded to include minimal width and gap between copper elements and ant-pads. In preparation for a more in-depth GUI change in the future, DFMStream’s analysis functions have been upgraded to give customers more options to manage the user workspace as well as adding a more modern feel to the analysis functions, a precursor of what’s to come in follow-on releases.
While the major focus of the release is on BluePrint and DFMStream, CAM350 also has seen enhancements based on end-user requests. “This release continues to expand focus on DFM and panel design, features we see as important requirement for customers trying to shorten market windows. With DFMStream and BluePrint well positioned in the market place, our efforts can now turn back to our flagship product for significant upgrades in 2016 and beyond,” said Almeida.
When prompted for motivation on this release and future upgrades, Almeida states, “Many companies are realizing that ultra-competitive scenarios are creating shorter windows in order to reap return on new product introduction (NPI). The DownStream product line mission is to help companies minimize iterations in design and manufacturing and placing a heavier emphasis on flawless NPI and getting the design right the first time through the design cycle. As this trend continues, it will become critical that verifying a design for manufacturability is moved further upstream so that manufacturing is built into the design upfront by the designer themselves.”
CAM350 Version 12.1 Highlights
ODB++ / IPC-2581 Support - full support is provided for the newer revisions of industry standard file format specifications including both import and export functions.
Multi Threading Support - full support for multi-threading has been implemented into the core DFMStream analysis algorithms. By taking advantage of native parallel processing in current multi-core processor, analysis times over a sample of designs were 3 to 5 times faster when compared to previous non-multi-thread enabled versions.
Expanded Support of Advanced Constructs and Design Techniques - New analysis options include trace to anti-pads on adjacent layers to validate 100% ground plane reference, and same net minimal spacing. In addition, analysis for negative planes was expanded to include minimal width and minimal gap between copper elements and anti-pads.
General Enhancements - Specific enhancements include enhanced detection for back drills, laser vias, and global fiducials, netlist compare for no connect nets, and so much more.
BluePrint-PCB Version 5.1 Highlights
Updated User Interface – The User Interface was updated to more current Windows standards. Toolbars and menus have been replaced with function-based ribbons. Commands that were previously several menu selections deep are now readily available from function specific ribbons. User interface elements previously fixed to the application frame can be detached from the application or hidden from view until recalled allowing the user complete control over the viewable area. Context sensitive ribbons with object specific commands and formatting options are presented for a selected item. The new update to the user interface provides expedient access to commands, reduces the learning curve and expedites the adoption of BluePrint for creating PCB documentation.
API Update - The application programming interface (API) was updated to increase the automation options available to users. New automation features include the ability to run BluePrint silently, prompt for a selection point, and the ability to retrieve geometry details from various BluePrint objects. These updates improve the existing robust API to provide greater flexibility when creating custom applications that interact with BluePrint.
Milling Pattern Checks - New milling pattern checking features were introduced to prevent or analyze a PCB assembly panel design for potential milling errors. Enable milling error prevention mode to create error free milling patterns based on user-defined criteria. User defined criteria includes mill tab keep in and keep out areas and minimal distances between mill tabs and adjacent objects. Additionally, compare milling patterns across all PCB images to ensure pattern match. Milling checks can also be performed as a post process or any time during the PCB assembly panel design process. These new milling checking options will virtually eliminate the incidence of milling errors in PCB assembly panel fabrication.
PCB Assembly Panel Documentation - PCB assembly panel documentation features were introduced to keep pace with user requests. These new features include panel specific document variables for use in creating custom dimensions and callouts. New panel specific dimension styles including panel coordinate dimensions and panel chamfer callouts. Additionally, the ability to associate (or pair) mill tabs and move them as a group. The new panel documentation features will facilitate creation of documentation with a greater set of requirements.
General Enhancements - BluePrint was significantly enhanced to support its expanding user base. Specific customer enhancements include automatic alignment of via graphics in stackup details, change a coordinate dimension to move the associated object, automated expansion of text boxes to accommodate large text strings, greater array of visibility settings for PCB and Design views and so much more.
Availability and Pricing
CAM350 Version 12.1 and BluePrint-PCB 5.1 are available now and are provided at no additional charge to all existing customers with a valid maintenance agreement. Actual content will vary based on end-users configuration. CAM350 12.1 pricing starts at $500.00 USD and BluePrint-PCB 5.1 pricing starts at $2,500.00 USD. For more information log onto downstreamtech.com, email sales@downstreamtech.com or contact a DownStream local Value Added Reseller (VAR).
About DownStream Technologies
DownStream Technologies, LLC is a software and services company focused on helping engineering organizations optimize and automate the PCB Release Process. Our tools redefine how engineering professionals post-process PCB designs to create and distribute all the deliverables required for a complete PCB assembly release package. CAM350® provides verification, optimization and output generation to efficiently drive PCB fabrication. DFMStream® is a comprehensive, yet easy-to-use tool suite designed to help engineers and designers verify design and manufacturing rules on PCB design databases, Gerber and NC data any time during the PCB design cycle. BluePrint for Printed Circuit Boards® works with CAM350® (and other PCB CAD systems) to help users quickly produce comprehensive electronic drawings to drive PCB fabrication, assembly and inspection processes. More information about DownStream can be found at downstreamtech.com
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.