Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Fast Interconnect Introduces Test Engineering Services
August 5, 2015 | Fast InterconnectEstimated reading time: Less than a minute
Full turn-key provider Fast Interconnect recently announced the expansion of its services to include test engineering services. Increased test coverage and reduced test times are the key qualification tools for enabling the best production yield. As detection of the manufacturing faults after the shipment impacts the customer's satisfaction and increases the overall cost of test and repair, it is important for the FAB and assembly houses to employ the right manufacturing test strategies. The product companies also need to collaborate with their FAB and Assembly houses to provide the right test processes, scripts and test programs.
According to Gary Griffin, the company’s co-founder, "Our Test Engineering group understands these manufacturing test strategies much better as we work very closely with the fabrication and assembly houses to produce quality printed circuit boards and packages. Our test engineering services are created to help you to achieve better test coverage and test times at a reduced cost. We provide integrated test engineering solutions involving Boundary Scan Test, Functional Test and Test process and equipment automation.”
Read more about Fast Interconnect here.
Share on:
Suggested Items
QuantumScape, Murata Announce Framework for Ceramics Collaboration
04/25/2025 | BUSINESS WIREQuantumScape Corporation, a global leader in next-generation solid-state lithium-metal battery technology, and Murata Manufacturing Co. have entered into the first phase of an agreement to explore a collaboration for high-volume manufacturing of ceramic film for QS’s solid-state battery technology.
Amtech Boosts Capabilities with New SMT Lines and Advanced Batch Washing System
04/25/2025 | AmtechAmtech Electrocircuits, a leading provider of manufacturing solutions, has announced a major upgrade to its production capabilities with the installation of multiple new SMT (Surface Mount Technology) lines and a state-of-the-art batch washing system.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/25/2025 | Nolan Johnson, I-Connect007I’m highlighting a discussion on the positive potential coming from the recent changes in global trade policy—from IPC’s Government Relations team, and from TTM CEO Tom Edman. In the realm of designers and purchasers realm, there’s news from Screaming Circuits and ASC/Sunstone Circuits to share. Finally, additive manufacturing and the release of CFX 2.0 highlight just some of the news coming to the shop floor as well.
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
TRI at SMTA Wisconsin Expo 2025
04/24/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join the SMTA Wisconsin Expo 2025.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in