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Mentor White Paper: Improving Characteristics of Serial Links
August 12, 2015 | Mentor GraphicsEstimated reading time: Less than a minute
Predicting and understanding the performance and the limiting factors of a serial data link is critical to the high-speed serial design process. To this end, we concern ourselves with characterization of active and non-linear components of serial data links, such as transmitters or buffers, by deconvolution of the impulse response from a pattern in either simulation or measurement environments.
Mathematical derivation of the calculation is given for "symmetrical" and "asymmetrical" edges, with discussion of singularity. The practical impact on simulation and measurement methodology is discussed, as well as overall improvement in accuracy with real DUTs. Simulation and measurement results are compared in this white paper.
To download this white paper, click here.
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Sweeney Ng - CEE PCBSuggested Items
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SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
10/29/2025 | SEMIGlobal shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reported today in its annual silicon shipment forecast.