-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Mentor White Paper: Improving Characteristics of Serial Links
August 12, 2015 | Mentor GraphicsEstimated reading time: Less than a minute
Predicting and understanding the performance and the limiting factors of a serial data link is critical to the high-speed serial design process. To this end, we concern ourselves with characterization of active and non-linear components of serial data links, such as transmitters or buffers, by deconvolution of the impulse response from a pattern in either simulation or measurement environments.
Mathematical derivation of the calculation is given for "symmetrical" and "asymmetrical" edges, with discussion of singularity. The practical impact on simulation and measurement methodology is discussed, as well as overall improvement in accuracy with real DUTs. Simulation and measurement results are compared in this white paper.
To download this white paper, click here.
Suggested Items
RTX's Collins Aerospace to Deliver Additional MAPS Gen II Units
12/03/2024 | RTXCollins Aerospace, an RTX business, received its fourth order for the Mounted Assured Positioning, Navigation (PNT) and Timing Generation II systems (MAPS Gen II), valued at $95 million.
Q3 2024 Global Semiconductor Equipment Billings Grew 19% YoY
12/03/2024 | SEMIGlobal semiconductor equipment billings increased 19% year-over-year to US$30.38 billion in the third quarter of 2024, while quarter-over-quarter billings registered 13% growth during the same period, SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
ULVAC Launches New Deposition System for Semiconductor Applications
12/02/2024 | JCN NewswireULVAC, Inc. has started accepting orders for the ENTRON-EXX, a new multi-chamber deposition system for semiconductor applications. The ENTRON-EXX builds on the proven productivity and flexibility of its predecessor, the ENTRON-EX W300, while offering enhanced data intelligence and expandability.
Scanfil Progressing Well in its CSRD
11/29/2024 | ScanfilThe Corporate Sustainability Reporting Directive (CSRD) is a significant legislative measure introduced by the European Union (EU) to enhance the transparency and accountability of companies regarding their environmental, social, and governance (ESG) impacts.
Is It the Death of the Dashboard?
11/27/2024 | Nolan Johnson, SMT007 MagazineIn 2024, companies are leveraging AI agents to automate data-driven decisions, bypassing the need for specialized data science skills. In this interview with Tim Burke and Jennifer Davis of Arch Systems, they say these AI tools can handle straightforward tasks, significantly improving factory efficiency by addressing numerous small issues. This shift allows existing staff to use data effectively without extensive retraining. Both large and small language models are used to support real-time decisions on the production floor, integrating various data sources to create a comprehensive digital twin of the factory’s operations.