-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
FCT Assembly to Showcase Comprehensive Product Line at SMTAI
September 1, 2015 | FCT AssemblyEstimated reading time: 1 minute
FCT Assembly, well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of products at SMTA International 2015, as well as take part in the conference program and live process demonstrations on the show floor.
From booth # 313 over September 29 and 30, the FCT exhibit will play host to the company’s stencil products, solder materials and NanoSlic™ stencil coatings. At its foundation, the company is a chemistry formulation expert and this know-how has informed the development of some major industry breakthroughs, which show delegates are invited to discuss with the FCT team.
A major highlight of the FCT exhibit is its market-leading stencil coating, NanoSlic. The revolutionary product has quickly emerged as the premiere coating technology for improved solder paste transfer efficiency, reduced underscreen cleaning requirements and overall printing yield improvements. Visitors can learn more about NanoSlic’s process advantages and also see a NanoSlic-coated Fine Line stencil in action at the “Inspection Experience”, where live printing and inspection of ultra-fine pitch deposits will take place throughout the two days of the SMTA International exhibit. Located at the show floor entrance, the Inspection Experience’s goal is to guide attendees through the printing, reflow and inspection processes and analyze common print and reflow challenges.
In addition to its show floor presence, FCT will also participate in the event’s conference program, during which findings from its latest development project -- a new flux formulation – will be shared. Tony Lentz, FCT Assembly Field Application Engineer, will present a paper entitled “Formulation of a New Liquid Flux for High Temperature Soldering” as part of the “The How's and Why's of Fluxes in Electronics Assembly” session set to take place on September 29th from 4:00 to 5:30 p.m. The paper underscores the need for fluxes that can accommodate thermally demanding applications where long contact times and soldering temperatures of up to 290°C are the norm, allowing for good hole fill and minimizing bridging and other defects.
For more information or to schedule an appointment, send an e-mail to jglanzer@fctassembly.com.
About FCT Assembly
FCT Assembly is a leader in the development and manufacture of advanced fluxes, high-performance solder materials, laser-cut SMT stencils and process-enabling stencil coatings. Integrating material formulation know-how and application expertise, FCT Assembly offers electronics assembly specialists comprehensive solutions for optimized material performance and robust deposition.
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.