-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
ANSYS Acquires Assets of Delcross Technologies
September 2, 2015 | PRNewswireEstimated reading time: 1 minute
ANSYS, the global leader of engineering simulation software, announced today that it has acquired substantially all the assets of Delcross Technologies, a premier developer of computational electromagnetic simulation and radio frequency system analysis software. The acquisition will enable ANSYS users to understand how antennas interact within their operating environments and how this behavior affects the system's overall ability to transmit and receive data without interference. Terms of the deal, which closed earlier this week, were not disclosed.
Driven by development for the Internet of Things, antennas are becoming increasingly pervasive across industries and products. Autonomous vehicles, smart metering, drones, bio-sensors and wearable electronics are just a few examples of products that now use one or more antennas and wireless systems to provide such services as voice, data communications, sensing and navigation. But these antennas and other electronic components can disrupt the operation of devices, a phenomenon known as electromagnetic interference, or EMI. Delcross' solutions identify and help mitigate EMI issues.
"ANSYS will bring Delcross' industry-leading technology to a broader market and further strengthen our leadership in antenna design, wireless system performance and EMI prediction," said Jim Cashman, ANSYS president and CEO. "The combined ANSYS high-frequency solution will deliver an unequalled portfolio for wireless system design. When we pair this expanded electronics offering with our best-in-class structures and fluids solutions, our users can create more complete virtual prototypes of whole systems."
"The combination of ANSYS and Delcross provides a powerful solution for next-generation wireless system design," said Matt Miller, Delcross president. "The acquisition opens new system opportunities and better positions ANSYS to meet the simulation needs of these important applications. That's why the Delcross team and I are extremely pleased to join ANSYS."
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex design challenges through fast, accurate and reliable engineering simulation. Our technology enables organizations ― no matter their industry ― to predict with confidence that their products will thrive in the real world. Customers trust our software to help ensure product integrity and drive business success through innovation. Founded in 1970, ANSYS employs over 2750 professionals, many of them experts in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, embedded software, system simulation and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales locations throughout the world with a network of channel partners in 40+ countries.
Suggested Items
Jabil Recognizes Nordson Electronics Solutions with the 2024 Best Strategic Supplier Award
02/05/2025 | Nordson CorporationNordson Electronics Solutions, a global leader in electronics manufacturing technologies, has been honored with the 2024 Jabil Best Strategic Supplier Award, underscoring Nordson’s essential role in enabling Jabil, a global leader in manufacturing services, to achieve operational excellence and deliver exceptional value across its supply chain.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Worldwide Semiconductor Revenue Grew 18% in 2024
02/03/2025 | Gartner, Inc.Worldwide semiconductor revenue in 2024 totaled $626 billion, an increase of 18.1% from 2024, according to preliminary results by Gartner, Inc. Revenue is projected to total $705 billion in 2025.
Transparent Electronics Market to Reach $2611 Million by 2030
01/31/2025 | BUSINESS WIREThe Global Transparent Electronics Market was valued at $963 Million in 2023 and is anticipated to reach $2611 Million by 2030, witnessing a CAGR of 15.4% during the forecast period 2024-2030.
The Future of Electronics Manufacturing in APAC
01/30/2025 | Daniel Schmidt, MKS' ATOTECHThe Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.