-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Kinsus Posts Weak Results in August
September 7, 2015 | DigitimesEstimated reading time: Less than a minute
IC substrate maker Kinsus Interconnect Technology has reported consolidated revenues of NT$1.861 billion (US$57.14 million) for August, down 1.5% sequentially and 15.9% on year, according to a Digitimes report. This is said to be because of decreased orders from Apple and slow demand for IC substrate products during the month.
Kinsus' sales are expected to rebound month by month after Apple unveils updated iPhones and other products this month.
Suggested Items
Global SiC Substrate Revenue Declines 9% in 2024; Long-Term Demand Remains Strong as 8-Inch Roadmap Gains Momentum
05/12/2025 | TrendForceTrendForce’s latest research shows that weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024.
Zhen Ding Releases April 2025 Monthly Revenue Report
05/07/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported April 2025 revenue of NT$13,589 million, up 22.90% YoY, marking a record high for the same period in the company’s history.
AT&S Starts High Volume Manufacturing at New Plant in Kulim/Malaysia
05/06/2025 | AT&SAT&S Austria Technologie & Systemtechnik (Malaysia) Sdn Bhd is ready to start high volume manufacturing at the new campus at Kulim Hi-Tech Park (KHTP) in the state of Kedah. AT&S Malaysia delivers high-end Integrated Circuit (IC) Substrates for AMD’s data center processors and other customers.
LG Innotek to Build FC-BGA into 700 Million USD Business with State-of-the-art Dream Factory
05/01/2025 | PR NewswireLG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on the 30th April.
Pioneering the Future of Substrate Manufacturing for North America
04/07/2025 | Marcy LaRont, I-Connect007In a rapidly evolving manufacturing landscape, the shift toward substrate technology has become a focal point for some companies in the PCB industry. Ralph Jacobo, technical sales and application engineer at all4-PCB, says all4-PCB has its roots in via-filling technology, has successfully navigated various market changes, and is now keenly focused on the demands of substrate manufacturing in North America. Ralph shares insights into the company's historical journey, current initiatives, and the innovative steps being taken to address the complexities of modern substrate processes.