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Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Kinsus Posts Weak Results in August
September 7, 2015 | DigitimesEstimated reading time: 1 minute
IC substrate maker Kinsus Interconnect Technology has reported consolidated revenues of NT$1.861 billion (US$57.14 million) for August, down 1.5% sequentially and 15.9% on year, according to a Digitimes report. This is said to be because of decreased orders from Apple and slow demand for IC substrate products during the month.
Kinsus' sales are expected to rebound month by month after Apple unveils updated iPhones and other products this month.
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Simon Khesin - Schmoll MaschinenSuggested Items
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Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
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EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates
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