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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Kinsus Posts Weak Results in August
September 7, 2015 | DigitimesEstimated reading time: Less than a minute
IC substrate maker Kinsus Interconnect Technology has reported consolidated revenues of NT$1.861 billion (US$57.14 million) for August, down 1.5% sequentially and 15.9% on year, according to a Digitimes report. This is said to be because of decreased orders from Apple and slow demand for IC substrate products during the month.
Kinsus' sales are expected to rebound month by month after Apple unveils updated iPhones and other products this month.
Suggested Items
The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
Enough Talk—Time to Strengthen America’s Microelectronics Industrial Base
06/09/2025 | James Will, USPAEThe U.S. doesn’t have an innovation problem in terms of microelectronics, or a talent problem or even an investment problem. What the U.S. has is a coordination problem, and that’s threatening the livelihood of our domestic microelectronics ecosystem.
Ventec International Group Enters into a Fulfillment and Supply Agreement with Matrix and Launches Ventec Americas
06/09/2025 | Ventec International GroupVentec is excited to announce a new partnership with Matrix aimed at enhancing the fulfillment, value-added conversion, and distribution of PCB base materials across the North American market. This collaboration is set to significantly improve supply chain efficiency, and delivery performance for the company's North American customers.
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,
IPC Applauds Leadership of Reps. Moore and Krishnamoorthi on PCB Manufacturing Bill
05/28/2025 | IPCIPC, the global electronics association serving more than 1,400 U.S. companies and over 3,200 worldwide, strongly supports the bipartisan reintroduction on May 28 of the Protecting Circuit Boards and Substrates (PCBS) Act in the 119th Congress.