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Murata Collaborates With Silicon Labs On IoT Matching Device
September 8, 2015 | Murata AmericasEstimated reading time: 1 minute
Murata Americas today announced the availability of its LFD21891MMF3D931 high frequency matching device for use in sub-GHz 802.15.4 wireless Internet of Things (IoT) applications. Designed in collaboration with Silicon Labs and optimized for use with their Si4461 868 MHz wireless transceiver IC, this solution incorporates all the necessary components in an ultra compact package. Encapsulated in a low profile device measuring just 2.0 x 1.25 x 0.7 mm, the footprint is approximately 75 percent smaller than traditional discrete components.
As the demand for IoT functionality increases, so too does the need for engineers to be able to quickly integrate wireless connectivity into applications. This typically requires a high level of wireless circuitry design expertise. The transceiver coupled with this LFD21891MMF3D931 optimized matching device helps reduce the product design cycle, as well as the amount of required engineering resources.
"Murata is continually innovating to meet the varied and complex needs of IoT customers. Taking this into account, we offer a range of solutions - from the basic component building blocks to fully integrated hardware and software modules. The LFD21891MMF3D931 sits at the center of this range to deliver IoT functionality in a turnkey solution," said Scott Klettke, General Manager - RF Products, Murata Americas.
More information can be found at www.murata.com.
About Murata
Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components and solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world.
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