Beyond Design: Radiation and Interference Coupling
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Fresh PCB Concepts: The Power of a Lunch & Learn for PCB Professionals
Keysight Technologies Co-Sponsors Characterization Seminar
September 9, 2015 | Keysight TechnologiesEstimated reading time: Less than a minute
Keysight is co-sponsoring a free seminar with Maury Microwave to explore various interconnected topics of device characterization that form the amplifier design flow, from component to circuit to system measurement and modeling. Additional topics include pulsed IV and S-parameters for compact model extraction, load pull for model validation and measurement, amplifier design and IC stability analysis, X-parameter modeling and system-level simulations.
During the Amplifier Design Flow—From Component to Circuit to System Measurement & Modeling seminar, instructors from Keysight and Maury Microwave will provide technical instruction and measurement demonstrations. Attendees will also have the opportunity to interact with experienced applications engineers.
When
Wednesday, Sept. 23 and Wednesday, Sept. 30
Where
Sept. 23 Event: Linthicum, MD, Hilton Baltimore BWI Airport, 1739 West Nursery Road, Linthicum, MD
Sept. 30 Event: Greensboro, NC, Greensboro-High Point Marriott Airport, 1 Marriott Drive, Greensboro, NC
For more information, visit www.keysight.com/find/events
Share on:
Suggested Items
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForceTrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.
Siemens Democratizes AI-driven PCB Design for Small and Medium Electronics Teams
05/21/2025 | SiemensSiemens Digital Industries Software announced today that it is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS™ Pro Essentials software and Xpedition™ Standard software.
Zuken Launches CR-8000 2025 with AI-Enhanced Support for High-Speed, High-Density PCB Design
05/21/2025 | ZukenZuken, a global leader in electronic design automation (EDA) solutions, has announced the release of the 2025 updates to its flagship PCB design applications, CR-8000 Design Gateway and Design Force.
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
05/20/2025 | Jerome Larez -- Column: Global PCB ConnectionsIn the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.