-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Inventec Launches Enhanced Co-Solvent
September 10, 2015 | InventecEstimated reading time: 2 minutes
For almost 2 decades, the Topklean EL 20 product range from Inventec Performance Chemicals (Inventec) has been the best in class co-solvent agent to be used mixed or separated with HFEs (hydrofluoroether) in vapour phase cleaning systems to remove solder flux residues, before application of conformal coatings, underfills or wire bonding process.
The cleaning action to remove baked-on solder flux residues after reflow, also known as defluxing, from printed circuit boards and power semiconductors has become more and more challenged because of the higher densities in today’s electronics, miniaturization, lower stand off components, and complex geometries This situation becomes even more difficult in lead free assembly where higher process temperatures are applied causing charring to flux residues.
The Topklean EL20P is the newest product in the range, it has been designed in response to the latest defluxing needs, formulated to have an outstanding capillary action by taking into consideration two main parameters: the penetration coefficient and the solvency power, it has a lower surface tension compared to other co-solvent agents in the market. The high wetting performance of Topklean EL20P allows to efficiently clean lead free fluxes after reflow which are hard to remove. Miniaturization and advanced packaging should not become a challenge for reliability anymore.
The main benefits offered by Topklean EL20P are:
- Enhanced solvency power to dissolve and remove Lead Free flux residues
- Faster cycle time due to its higher solvency and rinsing capabilities
- Lower ionic contamination
- Improved environmental performance. It is not toxic, it has a very low environmental impact and its formulation includes a high percentage of renewable raw materials.
- Great materials compatibility including labels placed on PCBA before cleaning process.
- Fully compatible with main vapour phase cleaning systems available in the market
Topklean EL20P is available worldwide in 20 l and 200 l drum containers.
About Inventec Performance Chemicals
Inventec is a division of the Dehon Group with head offices in Vincennes, France. The Electronic Business Unit is specialised in developing, manufacturing and supplying soldering, cleaning & coating materials used in the assembly of printed circuit boards and semiconductor packaging, contributing to sustainable development for high tech industries including automotive, telecom, industrial, energy, LED lighting, rail, aerospace, military and semiconductor. Inventec has 11 subsidiaries around the world, and production sites in France, Switzerland, Malaysia, China, United States and Mexico; all ISO 9001 certified and equipped with control and application laboratories to guarantee traceability, compliance with industry standards and consistency from batch to batch.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.