-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Henkel's Temperature Stable Solder Paste Living Up to its Promise
September 14, 2015 | HenkelEstimated reading time: 3 minutes

Earlier this year, Henkel Adhesive Technologies introduced the electronics market to the first-ever temperature stable solder paste, LOCTITE GC 10. Since its official debut in February, over 1,000 sample requests of the material have been fulfilled and customers who have qualified the game-changing solder paste are singing its praises.
Matt Polak, owner of Valley View, Ohio-based Raven Systems Design, describes his experience with LOCTITE GC 10. “We have always had issues with paste drying out prematurely and clogging fine-pitch apertures, even during the course of a daily production run,” he explains. “Because of the fine-pitch, high density nature and the reliability requirements of the products we are producing, re-using paste has always been out of the question and we expect to discard a minimum of 1/3 of the unused paste of every jar we open.
LOCTITE GC 10 has completely changed our traditional working models. The paste has given us nothing but perfect, consistent results with no refrigeration. In our evaluation, LOCTITE GC 10 came out of the jar perfect and the printing results at 60 hours were just as good as they were an hour after opening the jar. It printed and reflowed flawlessly and we achieved very close to 100% yield. In addition, we didn’t experience any aperture clogging, the stencil cleaned up easily and the paste didn’t dry out. The cost savings for our business are substantial and far outweigh any incremental cost differential versus competitive pastes. LOCTITE GC 10 is absolutely the ‘game changer’ it claims to be!”
LOCTITE GC 10’s value proposition is extensive, with benefits throughout the logistics and operations chains. Temperature stable at 26.5°C for one year and stable at temperatures of up to 40°C for one month, LOCTITE GC 10 overcomes the processing and performance challenges experienced by conventional solder paste products. Whereas traditional materials have abandon times ranging from 1 to 4 hours on average, LOCTITE GC 10 has abandon times of up to 24 hours, a stencil life of up to 72 hours and zero startup time. The formulation of the material delivers stabilized and consistent print transfer efficiency, an expanded reflow window and increased activity for better results with soak temperatures between 150°C and 200°C.
In addition to its proven performance and in-process cost-efficiency advantages, LOCTITE
GC 10 also provides substantial cost reductions for transport and storage. The temperature stability of the material eliminates the requirement for cold packing and overnight shipping and, once at the factory, can be stored at room temperature. Transportation costs are reduced and energy consumption at the facility is decreased.
When it comes to the logistics benefits of LOCTITE GC 10, Morey Corporation’s Technical Steward, Chris Murphy, enthusiastically shares his satisfaction. “Outside of its excellent process performance, which is always our top priority, the sheer simplicity and cost savings realized by LOCTITE GC 10’s hassle-free material management are incredible,” notes the 30-year veteran of Woodridge, Illinois-based EMS firm. “There is no taking it out of the refrigerator hours before a shift, no complex labeling and, best of all, start-up time is zero. We just take it off the shelf, put it on the stencil and start printing boards. We’ve left LOCTITE GC 10 on the stencil for more than eight hours and it was as creamy as when we first opened the jar – no kneading required. Plus, we can do away with expensive overnight shipping of solder paste and the worry about temperature exposure. With LOCTITE GC 10, we have a lot more latitude and that translates to a more efficient operation.”
More than four years in development, LOCTITE GC 10 has quickly become one of the most significant breakthroughs in solder materials in recent years. “The broad development process and multi-tiered beta testing LOCTITE GC 10 underwent gave us extreme confidence in its performance,” says Henkel Americas Sales Director, Brian Betti. “But, the market reception and incredibly fast adoption have been beyond our expectations. LOCTITE GC 10 is proving to be the game-changer manufacturers need for today’s demanding processes.”
All marks used above are trademarks and/or registered trademarks of Henkel and its affiliates in Germany and elsewhere.
About Henkel
Henkel operates worldwide with leading brands and technologies in three business areas:
Laundry & Home Care, Beauty Care and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 50,000 people and reported sales of $21.8 billion and adjusted operating profit of $3.4 billion in fiscal 2014. Henkel’s preferred shares are listed in the German stock index DAX.
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.