-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Henkel's Temperature Stable Solder Paste Living Up to its Promise
September 14, 2015 | HenkelEstimated reading time: 3 minutes
Earlier this year, Henkel Adhesive Technologies introduced the electronics market to the first-ever temperature stable solder paste, LOCTITE GC 10. Since its official debut in February, over 1,000 sample requests of the material have been fulfilled and customers who have qualified the game-changing solder paste are singing its praises.
Matt Polak, owner of Valley View, Ohio-based Raven Systems Design, describes his experience with LOCTITE GC 10. “We have always had issues with paste drying out prematurely and clogging fine-pitch apertures, even during the course of a daily production run,” he explains. “Because of the fine-pitch, high density nature and the reliability requirements of the products we are producing, re-using paste has always been out of the question and we expect to discard a minimum of 1/3 of the unused paste of every jar we open.
LOCTITE GC 10 has completely changed our traditional working models. The paste has given us nothing but perfect, consistent results with no refrigeration. In our evaluation, LOCTITE GC 10 came out of the jar perfect and the printing results at 60 hours were just as good as they were an hour after opening the jar. It printed and reflowed flawlessly and we achieved very close to 100% yield. In addition, we didn’t experience any aperture clogging, the stencil cleaned up easily and the paste didn’t dry out. The cost savings for our business are substantial and far outweigh any incremental cost differential versus competitive pastes. LOCTITE GC 10 is absolutely the ‘game changer’ it claims to be!”
LOCTITE GC 10’s value proposition is extensive, with benefits throughout the logistics and operations chains. Temperature stable at 26.5°C for one year and stable at temperatures of up to 40°C for one month, LOCTITE GC 10 overcomes the processing and performance challenges experienced by conventional solder paste products. Whereas traditional materials have abandon times ranging from 1 to 4 hours on average, LOCTITE GC 10 has abandon times of up to 24 hours, a stencil life of up to 72 hours and zero startup time. The formulation of the material delivers stabilized and consistent print transfer efficiency, an expanded reflow window and increased activity for better results with soak temperatures between 150°C and 200°C.
In addition to its proven performance and in-process cost-efficiency advantages, LOCTITE
GC 10 also provides substantial cost reductions for transport and storage. The temperature stability of the material eliminates the requirement for cold packing and overnight shipping and, once at the factory, can be stored at room temperature. Transportation costs are reduced and energy consumption at the facility is decreased.
When it comes to the logistics benefits of LOCTITE GC 10, Morey Corporation’s Technical Steward, Chris Murphy, enthusiastically shares his satisfaction. “Outside of its excellent process performance, which is always our top priority, the sheer simplicity and cost savings realized by LOCTITE GC 10’s hassle-free material management are incredible,” notes the 30-year veteran of Woodridge, Illinois-based EMS firm. “There is no taking it out of the refrigerator hours before a shift, no complex labeling and, best of all, start-up time is zero. We just take it off the shelf, put it on the stencil and start printing boards. We’ve left LOCTITE GC 10 on the stencil for more than eight hours and it was as creamy as when we first opened the jar – no kneading required. Plus, we can do away with expensive overnight shipping of solder paste and the worry about temperature exposure. With LOCTITE GC 10, we have a lot more latitude and that translates to a more efficient operation.”
More than four years in development, LOCTITE GC 10 has quickly become one of the most significant breakthroughs in solder materials in recent years. “The broad development process and multi-tiered beta testing LOCTITE GC 10 underwent gave us extreme confidence in its performance,” says Henkel Americas Sales Director, Brian Betti. “But, the market reception and incredibly fast adoption have been beyond our expectations. LOCTITE GC 10 is proving to be the game-changer manufacturers need for today’s demanding processes.”
All marks used above are trademarks and/or registered trademarks of Henkel and its affiliates in Germany and elsewhere.
About Henkel
Henkel operates worldwide with leading brands and technologies in three business areas:
Laundry & Home Care, Beauty Care and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 50,000 people and reported sales of $21.8 billion and adjusted operating profit of $3.4 billion in fiscal 2014. Henkel’s preferred shares are listed in the German stock index DAX.
Suggested Items
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.