Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Inovar Invests in MIRTEC’s SPI Systems to Decrease Solder Defects
September 15, 2015 | Inovar, Inc.Estimated reading time: 1 minute
Inovar, Inc., a full-service EMS provider, announces that it recently purchased and installed four MS-11 solder paste inspection (SPI) systems from MIRTEC.
The SPI systems currently are in use at Inovar on its three production lines as well as its prototype line.
Jef Nielsen, Process Engineering Manager, said that the systems allow Inovar to recognize problems with the application of solder paste onto the printed circuit boards (PCBs) in real time. The SPI machine is located directly after the screen printer machine in the production line. He added, “It is industry knowledge that a high percentage of solder defects can be attributed to problems with the solder paste application. These machines will quickly detect any deficiencies and allow for quick modifications to reduce the defect potential.” The machines also have statistical process control (SPC) software to track defects, thereby identifying the most problematic assemblies and defect types.
The MS-11 systems are configured with MIRTEC’s exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The high-speed precision In-line SPI system uses dual projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. Featuring an exclusive 15 mega pixel ISIS® vision system, the MS-11 series provides 10 micron/pixel precision telecentric compound lens design, 2 micron height accuracy, a precision closed-loop servo motor system, and extremely simple programming and operation. As an additional benefit, the systems provide MOIRÉ 3D phase step image processing, superior solder profile characterization, absolute repeatability and reproducibility, and precision laser PCB warpage compensation.
About Inovar, Inc.
Inovar, Inc. is a full-service EMS company that offers customers a wide range of high-quality manufacturing, supply chain and engineering solutions that suit their needs. Inovar’s industry understanding and experience is unparalleled. To find out more about the company’s notable achievements, services provided, key leadership and history, visit http://www.inovarEMS.com today.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.