-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
iNEMI / SMTA Workshop to Focus on Future Material Challenges for Automotive Electronics
September 15, 2015 | iNEMIEstimated reading time: 2 minutes
The International Electronics Manufacturing Initiative (iNEMI) and Surface Mount Technology Association (SMTA) will host a joint workshop on automotive electronics in conjunction with SEMICON Europa 2015 in Dresden, Germany. The one-day workshop, scheduled for October 5, will focus on how new material technologies are transforming automotive electronics and how the challenges that accompany their introduction can be successfully addressed.
"Future technology trends, coupled with new electronic materials and assembly techniques, will provide unparalleled opportunities to expand the boundaries of commercial possibilities in the automotive electronics market," said Grace O'Malley, vice president of operations for iNEMI. "At the same time, however, the increased penetration of electronics into the automotive market brings with it increased challenges for electronics manufacturers. Automotive environments demand more in terms of thermal cycling, shock and vibration capabilities, plus there is the expectation of longer term reliability. This workshop will address some of these challenges and begin a dialogue for industry-wide solutions."
Topics Covered
O'Malley says the workshop will cover a range of topics that encompass the breadth of the automotive electronics supply chain, such as:
- Latest trends in automotive electronics and the need for new materials
- Solutions for reducing both cost and energy consumption during assembly of in-cabin and infotainment systems
- How to achieve high-reliability assemblies in harsh environments for under-the-hood and powertrain electronics
- Solder materials for high-reliability automotive applicationsCharacterization of new materials including thermal materials and filled materials
- Acceptability criteria for assembly processing
Speakers
Confirmed speakers include:
- Dr. Stan Rak, Head of Materials Technology, Continental AG
- Steve Brown, Director of Automotive OEM Marketing, Alpha
- Karthik Vijay, Technical Manager, Indium
- Jörg Trodler, Senior Technical Manager, Heraeus Materials Technology
- Dr. Andreas Middendorf, Business Development, Fraunhofer Institute
- Jan Pedersen, Chief Supply Chain Officer, Elmatica / Chair of IPC 6012 Automotive Addendum
Registration
Registration for the workshop also includes access to the SEMICON Europa 2015 exhibition (October 6-8). Discounted registration rates are available for iNEMI, SEMI and SMTA members. For additional information.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies and related business operations.
About iNEMI
The International Electronics Manufacturing Initiative's mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. This industry-led consortium is made up of approximately 100 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China; Limerick, Ireland; and Tokyo, Japan.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.