-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Alpha Receives Best Paper Award at CISTF 2015 for Technical Presentation in Suzhou, China
September 23, 2015 | AlphaEstimated reading time: 2 minutes
Alpha, the world leader in the development and production of electronic soldering materials, was honored with “The Best Conference Paper Award of 2015 China International Solder Technology Forum & Exhibition” held on September 17th in Suzhou, China.
The technical paper, titled “Thermal and Mechanical Reliability of Low-Temperature Solder Alloys for Handheld Devices” was presented by Andy Yuen, Technical Services Director of Alpha Southern China and focused on discussing the use of micro-additives in eutectic Sn-Bi alloys to improve thermal fatigue and mechanical shock properties for handheld devices.
“We developed a new low temp, Pb-free, no-silver alloy with enhanced mechanical properties, particularly higher tensile strength and impact energy, which resulted in improved drop shock performance over standard SnBi alloy systems” said Andy. “The alloy is capable of delivering high reliability performance at lower soldering temperatures, leading to increased throughput and production value in your assembly process.”
Alpha’s paper was chosen from more than ten technical papers that were presented at the conference from well-known industry members. The CISTF Conference is jointly held by the ITRI-IPC China Solder Technology Group, International Tin Research Institute (ITRI, China) and IPC Association Connecting Electronics Industries (China) and was attended by around 250 industry affiliates.
To learn more about Alpha’s vast product offering and capabilities, please visit our site at alpha.alent.com.
Speaker Biography
Andy Yuen is the Technical Services Director of Alpha Southern China. Andy joined Alpha in 1978 and has held technical support responsibilities in the Asia-Pacific Region for more than 30 years. He is a frequent speaker on soldering materials, especially related to Surface Mount Assembly Technology and Reflow/Wave Lead Free Soldering. Andy is a graduate of Queen’s University at Kingston, Ontario, Canada and holds a Bachelor Degree in Chemical Engineering. He is a member of SMTA, IMAPS and ACS.
About Alpha
Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™, Maxrel™, and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, liquid fluxes, solder pastes, cored wire, conductive adhesives and preforms for use in used in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.alpha.alent.com.
Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.