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Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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Benchmark Electronics to Report 3Q 2015 Results on October 22
October 2, 2015 | Benchmark Electronics Inc.Estimated reading time: Less than a minute

Benchmark Electronics Inc. will announce its third quarter results for 2015 on October 22, 2015, before the market opens. The company will host a conference call to discuss these results on October 22, 2015, at 10:00 a.m. Central Time (11:00 a.m. Eastern Time).
The live webcast of the call and accompanying reference materials will be accessible by logging on to the company's website at www.bench.com. A replay of the broadcast will also be available until October 29 on the website.
For more information, please contact Lisa K. Weeks, VP of Strategy & Investor Relations, at 9798496550 (ext. 1361) or email at lisa.weeks@bench.com.
About Benchmark Electronics
Benchmark Electronics, Inc. provides integrated manufacturing, design, and engineering services to original equipment manufacturers of industrial control equipment (which includes equipment for the aerospace and defense industry), telecommunication equipment, computers and related products for business enterprises, medical devices, and testing and instrumentation products.
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Lincoln International’s EMS Stock Index Underperforms S&P
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Evaluation of Stencil Technology for Miniaturization
12/22/2017 | Neeta Agarwal, et al.*SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.
December Issue of SMT Magazine Available Now
12/04/2017 | I-Connect007The solder paste printing process accounts for almost 70% of PCB assembly defects. The December 2017 issue of SMT Magazine, which is available now, looks into the critical factors causing these challenges, and features strategies, tips and tricks, to help assemblers improve the yield and quality in the solder paste printing operation.