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IPC Seeks Posters for Display and Presentation at IPC APEX EXPO 2016
October 6, 2015 | IPCEstimated reading time: Less than a minute
IPC—Association Connecting Electronics Industries is seeking technical posters for presentation at the upcoming IPC APEX EXPO 2016 trade event, which will be held from March 15 to 17, 2016, at the Las Vegas Convention Center in Las Vegas, Nevada.
Submissions are being sought in all areas of the electronics industry, including design, materials, assembly, processes, and equipment; and topics may be on automation in electronics manufacturing, adhesives, assembly and rework processes, BGA/CSP packaging, black pad and other board-related defect issues, business and supply chain issues, cleaning, conformal coatings, corrosion, counterfeit electronics, failure analysis, flexible circuitry, PCB fabrication, robotics, soldering, surface finishes, test, inspection and AOI, tin whiskers, and many more.
The deadline for submission of abstracts is on December 11, 2015.
For more information about conference participation, please contact IPC Technical Conference Director Jasbir Bath or IPC Technical Programs Coordinator Toya Richardson at +1 847-597-2823.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.