Connect the Dots: Designing for Reality—Surface Finish
Fresh PCB Concepts: Tariffs and the Importance of a Diverse Supply Chain
Elementary Mr. Watson: The Road Ahead—Advances in PCB Design Technology
IPC Seeks Posters for Display and Presentation at IPC APEX EXPO 2016
October 6, 2015 | IPCEstimated reading time: Less than a minute
IPC—Association Connecting Electronics Industries is seeking technical posters for presentation at the upcoming IPC APEX EXPO 2016 trade event, which will be held from March 15 to 17, 2016, at the Las Vegas Convention Center in Las Vegas, Nevada.
Submissions are being sought in all areas of the electronics industry, including design, materials, assembly, processes, and equipment; and topics may be on automation in electronics manufacturing, adhesives, assembly and rework processes, BGA/CSP packaging, black pad and other board-related defect issues, business and supply chain issues, cleaning, conformal coatings, corrosion, counterfeit electronics, failure analysis, flexible circuitry, PCB fabrication, robotics, soldering, surface finishes, test, inspection and AOI, tin whiskers, and many more.
The deadline for submission of abstracts is on December 11, 2015.
For more information about conference participation, please contact IPC Technical Conference Director Jasbir Bath or IPC Technical Programs Coordinator Toya Richardson at +1 847-597-2823.
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