-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Zuken Innovation World Call for Papers Opens
October 7, 2015 | ZukenEstimated reading time: Less than a minute
Zuken is now accepting presentation abstracts for the ZIW 2016 Conference. As a user and technology conference, we welcome topics covering user experiences as well as technology topics of interest to the general design community. The presentation abstract can be based on a case study, challenging design experience, new technology trend or a solution to a common design problem. Each presentation selected for placement on the agenda is allotted 30 minutes.
The conference is organized into two tracks; one focused on board design and the other focused on electrical and harness design. Each track includes the associated engineering data management topics. Presentation topics are not required to include Zuken solutions.
The deadline for final submission is December 11, 2015.
For more information, click here.
Suggested Items
Kyocera Licenses Quadric’s Chimera GPNPU AI Processor IP
05/08/2025 | BUSINESS WIREQuadric announced that Kyocera Document Solutions Inc. (hereinafter: Kyocera) has licensed the Chimera™ general purpose neural processor (GPNPU) intellectual property (IP) core for use in next generation office automation system on-chip (SoC) designs.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
Cybord's Visual AI Solution to Be Integrated with Siemens' Opcenter MES
05/07/2025 | PRNewswireCybord, a leading provider of advanced visual-AI electronic component analytics, and Siemens Digital Industries Software have signed a new OEM agreement to integrate Cybord's cutting-edge AI technology with Siemens' Opcenter™ software for Manufacturing Execution Systems (MES).
SEL Announces 2025-2026 Scholarship Recipients
05/07/2025 | Schweitzer Engineering LaboratoriesSchweitzer Engineering Laboratories (SEL) is pleased to announce the latest recipients of the SEL Scholarship Program for the 2025-2026 academic year. This year, SEL has awarded 15 scholarships, each valued at $5,000, to exceptional students pursuing degrees in engineering and applied technology.
Baker Hughes' Waygate Unveils Nanotom HR for Advanced Inspection
05/06/2025 | Baker HughesWaygate Technologies, a Baker Hughes business and global leader in nondestructive testing (NDT) solutions for industrial inspection, unveiled its new extremely high-resolution computed tomography (CT) system, Phoenix Nanotom® HR (High Resolution) at the Control 2025 show in Stuttgart, Germany.