Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Smart Automation: The Journey of a Component Through an SMT Factory
Powering the Future: Why Thermal Management Defines the Future of Electronics
TRI Brings All New 3D AOI, SPI, AXI and ICT to Productronica 2015
October 9, 2015 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry will join Productronica 2015 in Munich, Germany to introduce all new 3D inspection and test solutions for PCBA, featuring the latest 3D AOI, 3D SPI, 3D AXI with CT and new generation electrical testing products. Come meet us at booth A2.320 from November 10 to November 13, 2015.
Featuring in TRI's 2015 portfolio are all new TR7700Q 3D AOI for ultra-precise assemblies, new TR7007QI stop-and-go SPI system designed for maximum accuracy with great cost-performance and new generation of acclaimed TR5001 SII INLINE multi-core ICT tester.
Also launching in 2015 is a unique CT upgrade for TR7600 series 3D AXI systems, bringing 3D CT inspection to our award winning x-ray inspection solutions.
Discover how TRI's complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Following Industry 4.0 criteria, TRI's SPI, AOI, AXI, MDA and ICT systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load using centralized control and data analysis.
Visit us in hall A2 booth 320 on November 10-13, 2015 to find out how much value our solutions can bring to your production line
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
KYZEN Focuses on Aqueous and Stencil Cleaning Solutions at SMTA Monterrey Expo and Tech Forum
04/10/2026 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum.
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
04/10/2026 | Real Time with... APEX EXPOJason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.