Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
TRI Brings All New 3D AOI, SPI, AXI and ICT to Productronica 2015
October 9, 2015 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry will join Productronica 2015 in Munich, Germany to introduce all new 3D inspection and test solutions for PCBA, featuring the latest 3D AOI, 3D SPI, 3D AXI with CT and new generation electrical testing products. Come meet us at booth A2.320 from November 10 to November 13, 2015.
Featuring in TRI's 2015 portfolio are all new TR7700Q 3D AOI for ultra-precise assemblies, new TR7007QI stop-and-go SPI system designed for maximum accuracy with great cost-performance and new generation of acclaimed TR5001 SII INLINE multi-core ICT tester.
Also launching in 2015 is a unique CT upgrade for TR7600 series 3D AXI systems, bringing 3D CT inspection to our award winning x-ray inspection solutions.
Discover how TRI's complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Following Industry 4.0 criteria, TRI's SPI, AOI, AXI, MDA and ICT systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load using centralized control and data analysis.
Visit us in hall A2 booth 320 on November 10-13, 2015 to find out how much value our solutions can bring to your production line
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements.
Share on:
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.