-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SMTA International 2015 Concludes Successfully
October 12, 2015 | SMTAEstimated reading time: 1 minute
SMTA International Conference and Exhibition, which took place September 27 – October 1, 2015 at the Donald E. Stephens Convention Center in Rosemont, IL, experienced a 20% increase in on-site attendance compared to 2014. International attendance was comparable to last year with attendees representing 21 different countries.
The technical conference continued the tradition of being the strongest in the electronics assembly industry. The Evolving Technologies Summit at the beginning of the week received much praise as it covered key technologies such as Alternate Alloys and Wearable Technology. A crowd filled the Opening Keynote Session until it was standing-room-only on Tuesday morning to hear Yole Développement CTO, Rozalia Beica, give an impressive overview of 3D Technology Trends and Manufacturing Challenges. The Lead-Free Soldering Technology Symposium kept the meeting room packed until the very end of the conference.
Over 180 exhibiting companies filled the sold-out exhibit hall. Traffic was consistently higher this year. A big attraction this year was the hands-on feature area called the Solder Paste and Solder Joint Automatic Inspection Experience, which was organized by Bob Willis with support from SMTA and NPL. Once again the Tech Tours program featured distinguished tour guides leading groups of attendees to exhibiting companies demonstrating inspection systems or placement equipment. The robotics feature, organized this year by Robotics Alley, welcomed back students from FIRST Robotics and 4-H Extension youth robotics teams and also featured field-ready robots from Paro and Recon Robotics as well as a hands-on soldering project for attendees.
Over 250 guests attended the JoAnn Stromberg’s Retirement Party on Tuesday evening. The evening featured guest speakers including past SMTA Presidents, staff, chapter officers, and long-time friends.
Next year the SMTA International Conference and Exhibition will be held September 25 - 29, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The IPC Fall Standards Development Committee Meetings will again be co-located.
For more information on SMTA International please contact Tanya Martin or 952-920-7682 or visit http://www.smta.org/smtai/.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.