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Libra Industries Now Offers Design Service CapabilitiesOctober 21, 2015 | Libra Industries
Estimated reading time: 1 minute
Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that through the acquisition of ACD, the company has added state-of-the-art design services to its capabilities. At Libra Industries, the printed circuit board (PCB) design process encourages direct communication with the designer throughout the process, utilizing face-to-face visits as well as the latest web-based communication tools, including WebEx.
The company employs a team of specialized senior level designers that have extensive experience in the following:
- High Frequency RF Boards
- XPCI Backplane
- Large Multi-Processor Motherboards
- Latest Memory Busses Including DDR2 and DDR3
- High Amperage and Voltage Designs
- Multiple Lamination Designs using Buried, Blind, and Micro/Laser Drills
- Buried Resistor Technology
- Complicated Impedance Designs
- Controlled High Speed Busses on Current Chipsets
- Analog and Digital Mixed Designs
- Flex and Rigid Flex Designs
- ATE Design
- Probe Design
- RF Antenna Designs
Libra Industries’ design approach achieves intuitive placement and routing focused on superior signal integrity with low EMI, resulting in CAM verified manufacturing ready data.
Libra Industries continues to invest to provide customized manufacturing solutions to help make its customers more competitive and improve their profitability. For more information, visit www.libraind.com.
About Libra Industries
Libra Industries is a leading provider of integrated Electronic Manufacturing Services (EMS), serving OEMs with complex or technologically sophisticated manufacturing requirements in a broad range of industries including industrial automation, medical, military and aerospace, instrumentation and LED lighting. Four world-class manufacturing facilities allow Libra Industries to provide customers with manufacturing flexibility including complete system build, module and subassembly production, as well as simple to complex PC board assembly. With an ongoing commitment to investment in people, quality systems, and the latest manufacturing equipment and processes, Libra Industries is committed to managing their clients’ products from initial design and prototype to full production; assisting their clients in their efforts to improve time to market, reduce total systems cost, and increase quality.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.