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Sign up for Mentor’s Oct. 22 Library and Component Management Webinar
October 21, 2015 | Mentor GraphicsEstimated reading time: Less than a minute
The PCB is central to systems development, and the quality of your component libraries can have a dramatic impact on product performance, cost and quality. In a survey of the design community, when asked what were the key technologies required to improve their PCB Data Management, the two top items were:
- Centralized Library Management: 91%
- Component Management: 83%
Are you experiencing any of the following challenges?
- Engineers can’t find information on current parts
- No history tracking: who made what change, when, and why
- No process to prevent engineers from using parts that are undesirable or obsolete
- No process to ensure consistency and accuracy of part data
- Inaccurate component data causing BOM issues in manufacturing
- New parts are holding up the design process
If so, please attend the Library and Component Management Webinar at 10 am Eastern on October 22, 2015.
What you Will Learn:
- Component library structure for the Netlist and Integrated Flows
- Suggestions for configuring component libraries efficiently
- How to get started with a new component library
- How xDX DataBook can help you manage component parametric data
- Using tools for updating and maintaining current component data
Click here for more information, or to register.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.