Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Qualcomm, Amazon Announce Multi-Generational AI Data Center Collaboration

09/14/2026 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced a multi-generation collaboration with Amazon to enable customized silicon at scale for large-scale AI data centers, working together on AI inference.

RapidDirect Launches PCB Division to Integrate PCB and Mechanical Manufacturing

09/11/2026 | Globe Newswire
RapidDirect, a leading global provider of custom on-demand digital manufacturing, announced the official launch of its new Printed Circuit Board (PCB) division.

Top 10 Fabless IC Design Houses Post 73% YoY Growth in 2Q26; AMD Enters Top Three

09/11/2026 | TrendForce
According to TrendForce’s latest IC design industry research, expanding AI applications continued to drive demand for GPUs, CPUs, ASICs, and interconnect products.

Semiconductor Design Market to Reach $69.43B by 2035

09/10/2026 | Globe Newswire
According to SNS Insider, the global Semiconductor Design Market was valued at $25.23 Billion in 2025 and is projected to reach USD 69.43 Billion by 2035, registering a CAGR of 10.67% from 2026 to 2035.

HyperLight Welcomes VentureTech Alliance to Series C

09/09/2026 | BUSINESS WIRE
HyperLight Corporation, a leader in thin-film lithium niobate (TFLN) photonics, announced that VentureTech Alliance (VTA) has joined its Series C financing round.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in