Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
Have You Seen I-Connect007's Coverage of productronica 2015?
November 17, 2015 | I-Connect007Estimated reading time: 1 minute
If you didn’t make it to Munich for productronica 2015, don’t worry. I-Connect007 has complete coverage of this long-running industry event at our RealTime with... show site.
About 38,000 visitors from around the world helped celebrate the 40th anniversary of productronica, and show managers say the share of Asian attendees rose “considerably” this year. And 97% of visitors rated productronica “good” to “excellent,” according to reports.
“During the past four days of the fair, we have experienced the industry's unbelievable innovative strength,” said Falk Senger, managing director of Messe München. "That underscores productronica's position as an international industry gathering for electronics development and production."
This year’s show also marked a first: The launch of the productronica Innovation Awards. A panel of judges chose the most innovative products from almost 70 entries. Winners included Fuji Machine (PCB & EMS), Rehm Thermal (SMT), F&K Delvotec (Semiconductors), Schleuniger (Cables, Coils & Hybrids), and Asys (Future Markets).
Thanks to our generous sponsors, the I-Connect007 team was available to cover the show from start to finish. The result? A total of 18 in-depth RealTime with…productronica video interviews with the industry’s top engineers, technologists, and managers, along with 126 photos of the event.
We’ll also be bringing you written interviews with these movers and shakers in the next few months, courtesy of The PCB Magazine, SMT Magazine, and The PCB Design Magazine.
So, if you didn’t make it across the pond last week, don’t despair. We have you covered. To view I-Connect007’s video coverage of productronica 2015, click here.
Share on:
Suggested Items
Intel Appoints Lip-Bu Tan as Chief Executive Officer
03/13/2025 | Intel CorporationIntel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
03/13/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announces the retirement of Tom Forsythe, Executive Vice President, effective December 31, 2024, after more than three decades of service to the company and the electronics manufacturing industry.
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
03/13/2025 | Technica USATechnica USA, a leading provider of materials, equipment, installation, and services for the printed circuit board (PCB) fabrication, PCB Assembly, substrates, MEMS, and semiconductor industries, proudly announces its 40th anniversary in 2025.
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.