Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
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Designers Notebook: Layer Stackup Planning for RF Circuit Boards
New PCB Conference at 2015 IPC & APEX South China Fair
November 17, 2015 | HKPCAEstimated reading time: Less than a minute
The 2015 International Printed Circuit & APEX South China Fair, which will be held from December 2-4, 2015 at the Shenzhen Convention & Exhibition Center in Shenzhen, China, will highlight the PCB GIGA Conference – a professional, high-profile industry conference that aims to offer practical solutions and useful insights for industry players to better equip themselves for a sustainable development of the industry.
To be presented in versatile formats in keynote speech, panel discussion and case studies, the PCB GIGA Conference has been strategically divided into the following four themes:
- Market Evolution (December 2)
- Green Solutions (December 3)
- Smart Automation (December 3)
- Flexi & Ceramic PCB Market Trend (December 4)
The PCB GIGA Conference will provide attendees an update on market outlook and challenge; smart automation development in the semiconductor industry; global market trend forecast; and PCB application trends in key segments.
For more information and to pre-register, visit www.hkpca-ipc.show.org.
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