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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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New PCB Conference at 2015 IPC & APEX South China FairNovember 17, 2015 | HKPCA
Estimated reading time: Less than a minute
The 2015 International Printed Circuit & APEX South China Fair, which will be held from December 2-4, 2015 at the Shenzhen Convention & Exhibition Center in Shenzhen, China, will highlight the PCB GIGA Conference – a professional, high-profile industry conference that aims to offer practical solutions and useful insights for industry players to better equip themselves for a sustainable development of the industry.
To be presented in versatile formats in keynote speech, panel discussion and case studies, the PCB GIGA Conference has been strategically divided into the following four themes:
- Market Evolution (December 2)
- Green Solutions (December 3)
- Smart Automation (December 3)
- Flexi & Ceramic PCB Market Trend (December 4)
The PCB GIGA Conference will provide attendees an update on market outlook and challenge; smart automation development in the semiconductor industry; global market trend forecast; and PCB application trends in key segments.
For more information and to pre-register, visit www.hkpca-ipc.show.org.
ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce its return to IPC APEX 2024, the largest electronics manufacturing event in North America. ViTrox eagerly invites visitors to explore our offerings at Booth #2642, Anaheim Convention Center, LA, from April 9th to 11th. During this time, we will unveil a series of cutting-edge inspection solutions poised to revolutionize manufacturing production lines.
You have an excellent idea for a new standard in the electronics manufacturing industry. How do you turn that idea into a reality? It’s simple: You submit a PIN to the TAEC. Now, what does that even mean? To develop a new standard, you need the help of the IPC Technical Activities Executive Committee (TAEC) Global. Ideas for new IPC standards are submitted via Project Identification Notification (PIN) to TAEC Global, which conducts an initial review. The PIN is then sent to the general TAEC standards development oversight committee for review and approval. Now, how do they review it and who comprises the committee?
When high school students face an upcoming test, they may experience a mix of dread and excitement, depending on the source material and how well they’ve prepared. Similarly, professionals sitting for a certification exam to test their knowledge of IPC standards may feel a whirlwind of emotions. However, these aren't just any exams; they’re meant for operators, engineers, and managers building the critical infrastructure of our world’s most essential electronics systems.
On the cusp of another IPC APEX EXPO, we focus on how bare board fabricators can maximize their time and investment at the show. We visited with Matt Kelly, IPC chief technologist, and Julia Gumminger, IPC professional development and events manager, as well as Udo Welzel and Stanton Rak, the chairs of the technical program committee, to discuss the technical depth and breadth that the 2024 show will bring to fabricators and professionals all along the supply chain.
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status.