-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
KIC Launches Global Rebranding
November 23, 2015 | KICEstimated reading time: 1 minute
KIC has announced a global rebranding and introduced a new tagline to better represent its goals: "Making Ovens Smarter." For nearly 30 years, KIC has been leading the industry for automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes.
Over the last decade, reflow oven manufacturers have done a great job of making their ovens more stable, reliable and less expensive. Looking forward, the majority of additional customer value will be created in the utilization of the ovens, and that is the area where KIC has and continues to develop new technologies. These new capabilities lead to reduced production cost, higher quality and new capabilities that the electronic assembly market is starting to demand. The smart technologies can be grouped into the following areas:
Process transparency: Automatically measure the PCB profile and its match to the relevant process window. Share this continuous and near real-time process and traceability data with all authorized personnel and MES over the factory’s LAN. True process data helps the maintenance people troubleshoot and fix issues faster.
Flexible + Fast: As electronic product variety keeps growing, the result is more frequent production line changeover. Productivity is lost when a multimillion dollar production line waits 15-30+ minutes on a $50,000 oven to stabilize on the new recipe. KIC’s technology provides either near instant oven changeover time or dramatically reduced downtime.
Automation: Humans have many wonderful talents, but consistency in repetitive tasks is not one of them. KIC’s automatic systems eliminate manual tasks such as periodic manual profiling and reduce the opportunities for human mistakes in setting up and running the ovens.
Reduced electricity consumption: KIC’s oven setup software has proven to reduce oven electricity use by up to 15 percent in numerous case studies.
One exciting aspect of these smart technologies is that they are retrofitable on virtually all oven models at nearly any age. Now the entire factory can use smart oven technologies. For more information, visit www.kicthermal.com.
Suggested Items
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
Altus Supplies Dual Lane Reflow Oven to Triple CEM’s Production Capacity
03/20/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has partnered with Garner Osborne Circuits, a UK-based Contract Electronics Manufacturer, to install a Dual Lane Heller 1707 MK7 reflow oven.
Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
02/04/2025 | SolderStarSolderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Incap India Invests in New SMT Technology
01/24/2025 | IncapIncap India has invested approximately EUR 1 million in a new SMT (surface-mount technology) production line at its third factory in Tumkur.