Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
Target Condition: Floor Planning Without a Floor
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
IPC Standards Committee Reports – Component Traceability, Base Materials, Fabrication Processes, Assembly and Joining
December 1, 2015 | IPCEstimated reading time: 5 minutes
The 5-22arr J-STD-001/Conformal Coating Material & Application Industry Assessment Task Group discussed the current status of round robin testing.
The 5-22as Task Group met to discuss an addendum to 5-22as, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies.
The 5-22f IPC-HDBK-001 Task Group celebrated the completion of the forthcoming revision to IPC-HDBK-001, Handbook and Guide to Supplement J-STD-001, and discussed opening the document for an amendment to address changes as a result of J-STD-001F, Am 1.
The 5-23a Printed Circuit Board Solderability Specifications Task Group reviewed all comments submitted on the Amendment 1 to the J-STD-002D, including the substantial number from Jim Daggett of Raytheon.
The 5-23b Component and Wire Solderability Specification Task Group reviewed some potential changes to J-STD-003C that may just allow the people from DSCC to accept what could be the revision D of this standard.
The 5-24a Flux Specifications Task Group reviewed the SIR test method verification plan, including comparing the current J-STD-004 plan with the IEC round robin plan to determine the test board preparation procedures, specify the testing protocol and set the timing for the testing.
The 5-24b Solder Paste Task Group reviewed testing of solder balls, paste wetting and tackiness (tack) plus discussed rheometry testing using both parallel plate and spiral pump viscometers.
The 5-24c Solder Alloy Task Group discussed the addition of one more patented lead free alloy to J-STD-006; the best way to address the addition of rare earth elements to lead free alloys and then discussed three IPC TM-650 test methods that will be placed in the 5-24c TG KAVI site for additional discussion by members of the task group.
Page 2 of 2Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
Indium Promotes Huang to Senior Manager, Marketing Communications
08/28/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing Communications, to continue to lead the company’s branding and promotional efforts.
Rehm Academy Expands Its Training Program
08/28/2025 | Rehm Thermal SystemsThe demands on modern industrial companies and employees continue to rise, and therefore, the topic of further education is becoming increasingly important today.
MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider
08/28/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.