Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
Beyond Design: The Metamorphosis of the PCB Router
IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
December 7, 2015 | IPCEstimated reading time: 4 minutes
The reactivated D-22 High Speed/High Frequency Design Subcommittee met to review an initial draft of IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards. While agreed that the document is not intended to be used as a stand-alone document (it will support the IPC-2221B, Generic Standard on Printed Board Design), the initial draft does contain a substantial amount of “how-to 101” tutorial information for the designer as taken from the older IPC-2252, Design Guide for RF/Microwave Printed Boards. It was decided that IPC should conduct an open-ended industry survey that asks two basic questions to help steer the course of the IPC-2228:
- If a printed board fabricator switched up a job from an FR-4 board (IPC-6012) to an RF board (IPC-6018), what things would the fabricator need to focus on for that job (e.g. drilling, plating and marking)?
- What elements of fabrication and assembly are different between traditional rigid printed boards and RF printed boards that IPC should focus on (e.g. sequential lamination, back drilling and material handling)?
The D-22 High Speed/High Frequency Performance Subcommittee met to complete the process of reviewing and providing disposition to industry comments submitted during the summer 2015 Final Draft circulation of IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards. The document will now be prepared for official balloting and a corresponding IPC-6018CS Space and Military Avionics Applications Addendum will also be drafted for a 2016 release.
The D-24a TDR Test Methods Task Group met to review the status of the Gage R&R Validation Program for the forthcoming “B” Revision to IPC-TM-650, Method 2.5.5.7, Characteristic Impedance of Lines on Printed Boards by TDR.
The D-24b Bereskin Test Methods Task Group met to review two different industry approaches to addressing the Bereskin stripline resonator test method that lends itself to the test and measurement of Dk and Df of thin dielectric materials up to 20 GHz. An IPC-TM-650 Test Method could be developed that provides both procedures as Methods A and B.
The D-24c High Frequency Test Methods Task Group meet to review data from five participating companies in a round robin test program that will assess the state-of-the-art of test material provides and testing labs in the measurement of dielectric properties of materials at frequencies above 10 GHz. A variety of test methods are being utilized based on current practices utilized in commerce.
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