Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
Target Condition: Floor Planning Without a Floor
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
December 7, 2015 | IPCEstimated reading time: 4 minutes
The reactivated D-22 High Speed/High Frequency Design Subcommittee met to review an initial draft of IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards. While agreed that the document is not intended to be used as a stand-alone document (it will support the IPC-2221B, Generic Standard on Printed Board Design), the initial draft does contain a substantial amount of “how-to 101” tutorial information for the designer as taken from the older IPC-2252, Design Guide for RF/Microwave Printed Boards. It was decided that IPC should conduct an open-ended industry survey that asks two basic questions to help steer the course of the IPC-2228:
- If a printed board fabricator switched up a job from an FR-4 board (IPC-6012) to an RF board (IPC-6018), what things would the fabricator need to focus on for that job (e.g. drilling, plating and marking)?
- What elements of fabrication and assembly are different between traditional rigid printed boards and RF printed boards that IPC should focus on (e.g. sequential lamination, back drilling and material handling)?
The D-22 High Speed/High Frequency Performance Subcommittee met to complete the process of reviewing and providing disposition to industry comments submitted during the summer 2015 Final Draft circulation of IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards. The document will now be prepared for official balloting and a corresponding IPC-6018CS Space and Military Avionics Applications Addendum will also be drafted for a 2016 release.
The D-24a TDR Test Methods Task Group met to review the status of the Gage R&R Validation Program for the forthcoming “B” Revision to IPC-TM-650, Method 2.5.5.7, Characteristic Impedance of Lines on Printed Boards by TDR.
The D-24b Bereskin Test Methods Task Group met to review two different industry approaches to addressing the Bereskin stripline resonator test method that lends itself to the test and measurement of Dk and Df of thin dielectric materials up to 20 GHz. An IPC-TM-650 Test Method could be developed that provides both procedures as Methods A and B.
The D-24c High Frequency Test Methods Task Group meet to review data from five participating companies in a round robin test program that will assess the state-of-the-art of test material provides and testing labs in the measurement of dielectric properties of materials at frequencies above 10 GHz. A variety of test methods are being utilized based on current practices utilized in commerce.
Page 2 of 3
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
The Global Electronics Association Launches Design Village at APEX EXPO 2026
09/02/2025 | Global Electronics AssociationAPEX EXPO, the hallmark electronics tradeshow hosted by the Global Electronics Association, announced the launch of the Design Village, a new feature in the exhibit hall that will unite the world’s leading innovators and showcase next-generation solutions for the electronics industry.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.
Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
08/26/2025 | John Watson -- Column: Elementary, Mr. WatsonI’d like to share a harsh truth, and I say this as a friend: PCB designers are often their own worst enemy. It’s rarely the complexity of the circuit, the last-minute changes from mechanical, the limited enclosure space, or the ever-expanding list of design rules that send projects to the dust heap of failed boards. More often, it's our own decisions, made too quickly and narrowly, and with too little foresight, that sabotage an otherwise good design.
Target Condition: Floor Planning Without a Floor
08/27/2025 | Kelly Dack -- Column: Target ConditionBy a show of hands, how many PCB designers have been asked to start a layout without a board outline, keep-out zones, or even height constraints? How many have had to work within a specific enclosure before the schematic was finalized? If this sounds familiar, you're not alone. Starting a PCB layout without critical constraints is like hiring an interior designer to buy furniture and carpet for a house you haven’t even purchased yet, or, even worse, trying to fit four bedrooms' worth of furniture in a one-room cabin.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
08/22/2025 | Andy Shaughnessy, I-Connect007In this week’s roundup, we have a variety of articles covering design, manufacturing, sustainability, and, of course, tariff negotiations. We have a milestone anniversary to celebrate as well, with Dan Beaulieu about to publish his 1,000th column. When does Dan even sleep? Here’s to hoping that we have 1,000 more weeks of "It’s Only Common Sense."