Basic Technology of High Thermally-durable All-solid-state Lithium ion Battery Developed
December 8, 2015 | Tohoku UniversityEstimated reading time: 1 minute
This technology is significant as it allows the thermally durable Li-ion battery to be used in a wider variety of applications, such as large-scale industrial machines with motors, and medical machines which need to be heated for autoclave sterilization. Since this technology does not require the cooling system common in conventional Li-ion batteries, it is expected to lead to further developments of compact battery systems and reduce overall costs.
The high energy density Li-ion battery is already being used as power sources in applications such as portable devices (smartphones and tablets), electric vehicles and adjustor of the supply and demand of renewable energy.
The conventional Li-ion battery consists of a separator, a positive electrode layer and a negative electrode layer (Fig.1 (a)). The battery is filled with organic electrolyte solution in which lithium ion conducts between the two electrode layers during the charge and discharge process.
An issue of the conventional Li-ion battery, with the organic electrolyte solution, is thermal durability. The upper operating temperature is limited to around 60°C owing to volatility of the organic electrolyte solution. Consequently, it is difficult to use the conventional Li-ion battery in a high temperature environment without a cooling system.
Therefore, the solid electrolyte with no volatility has been developed for the utilization of Li-ion battery in a high temperature environment. The lithium ion conductivity of solid electrolyte, however, is lower than that of the organic electrolyte solution, and the internal resistance of all-solid-state Li-ion battery should be reduced for its commercialization.
Prof. Shin-ichi Orimo's lab in AIMR and the Institute for Material Research at Tohoku University have been conducting research on LiBH4-based complex hydrides as novel and solid electrolytes. They have confirmed the fast lithium ion conductivity in the wide temperature range from room temperature to 150°C.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
Laird Thermal Systems Unveils New Identity
05/05/2025 | Laird Thermal SystemsLaird Thermal Systems, a global leader in active thermal management solutions with more than 60 years of application expertise, today announced its rebrand to Tark Thermal Solutions.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.