Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
IPC APEX EXPO 2016 Educational Programs Highlight Research, Innovation and Forward Thinking
December 14, 2015 | IPCEstimated reading time: 2 minutes
The latest technical research, industry best practices, ground-breaking technologies and forward thinking innovations will take center stage throughout the IPC APEX EXPO 2016 technical conference and professional development courses, which will take place March 13–17 at the Las Vegas Convention Center in Las Vegas, Nevada. Registration is now open at www.IPCAPEXEXPO.org.
In keeping with the event’s theme, “Forward Thinking for Tomorrow’s Technology,” the technical conference will feature approximately 80 technical papers detailing original research and innovations from industry experts around the world. Subject-matter experts will cover topics in the areas of board fabrication and design, electronics assembly and test.
Attendees wanting to learn more about best practices in design, lead-free technologies, materials, process improvement, solder joint reliability, PCB fabrication and materials, quality and reliability and more, can choose from 20 professional development courses that go beyond theory to provide practical solutions that could be implemented immediately.
“Our wide-ranging educational program features a variety of learning opportunities where attendees can access the latest research and development in the industry and learn more about trending materials, applications and processes such as graphene, printed electronics and 3D printing,” said IPC Technical Conference Director Jasbir Bath. “They can take everything they learn back to their company and put it all to work.”
In addition, IPC APEX EXPO features many free activities, including technical BUZZ sessions, poster presentations, keynotes on “Inventions and Innovations” by inventor and entrepreneur Dean Kamen and “Inside the Rise of the Warbots” by strategist and senior fellow at the New America Foundation, Peter Singer. The highly popular New Products Corridor and the IPC APEX EXPO Hand Soldering Competition will again be featured along with more than 440 of the industry’s top suppliers.
Access to the exhibit hall is free to those who register in advance, a savings of $35 on-site. Attendees who register by January 29, 2016, will save 20 percent off registration fees. In addition, attendees who register for the All-Access Package will save a significant percentage off a la carte options.
More information about IPC APEX EXPO 2016, including details on education and technology, network opportunities, show floor activities, schedule, travel and more is available at www.IPCAPEXEXPO.org.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.