Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
IPC APEX EXPO 2016 Educational Programs Highlight Research, Innovation and Forward Thinking
December 14, 2015 | IPCEstimated reading time: 2 minutes
The latest technical research, industry best practices, ground-breaking technologies and forward thinking innovations will take center stage throughout the IPC APEX EXPO 2016 technical conference and professional development courses, which will take place March 13–17 at the Las Vegas Convention Center in Las Vegas, Nevada. Registration is now open at www.IPCAPEXEXPO.org.
In keeping with the event’s theme, “Forward Thinking for Tomorrow’s Technology,” the technical conference will feature approximately 80 technical papers detailing original research and innovations from industry experts around the world. Subject-matter experts will cover topics in the areas of board fabrication and design, electronics assembly and test.
Attendees wanting to learn more about best practices in design, lead-free technologies, materials, process improvement, solder joint reliability, PCB fabrication and materials, quality and reliability and more, can choose from 20 professional development courses that go beyond theory to provide practical solutions that could be implemented immediately.
“Our wide-ranging educational program features a variety of learning opportunities where attendees can access the latest research and development in the industry and learn more about trending materials, applications and processes such as graphene, printed electronics and 3D printing,” said IPC Technical Conference Director Jasbir Bath. “They can take everything they learn back to their company and put it all to work.”
In addition, IPC APEX EXPO features many free activities, including technical BUZZ sessions, poster presentations, keynotes on “Inventions and Innovations” by inventor and entrepreneur Dean Kamen and “Inside the Rise of the Warbots” by strategist and senior fellow at the New America Foundation, Peter Singer. The highly popular New Products Corridor and the IPC APEX EXPO Hand Soldering Competition will again be featured along with more than 440 of the industry’s top suppliers.
Access to the exhibit hall is free to those who register in advance, a savings of $35 on-site. Attendees who register by January 29, 2016, will save 20 percent off registration fees. In addition, attendees who register for the All-Access Package will save a significant percentage off a la carte options.
More information about IPC APEX EXPO 2016, including details on education and technology, network opportunities, show floor activities, schedule, travel and more is available at www.IPCAPEXEXPO.org.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.