Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals
December 15, 2015 | IPCEstimated reading time: 2 minutes
The D-64 Printed Electronics Final Assembly Subcommittee and D-64a Printed Electronics Terms and Definitions Task Group announced publication of IPC/JPCA-6901, Performance Requirements for Printed Electronics Assemblies and IPC-6903, Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry), respectively. The groups will formally celebrate these new standards at APEX/EXPO.
D-64 is now undertaking development of IPC-6902, Qualification and Performance Specifications for Printed Electronics (Additive Circuitry). It is doing so as a joint effort with the D-61 Printed Electronics Design Subcommittee. That subcommittee launched work on IPC-2292, IPC-2292, Design Standard for Printed Electronics on Flexible Substrates, which will be the first in a potential series of design standards for printed electronics. Because these groups’ efforts are so closely intertwined, they will meet jointly throughout their processes.
The D-62 Printed Electronics Base Materials Substrates Subcommittee and D-63 Printed Electronics Functional Materials Subcommittee seek to expand the reach for the materials specification sheets in their standards. Both groups plan to create generic categories of materials and will begin gathering information from suppliers to build these categories and come up with requirement ranges for generic specification sheets.
The D-65 Printed Electronics Test Methods Development Subcommittee continues to make headway creating standardized testing for flexibility and stretchability.
Conflict Minerals
The E-30 Committee celebrated the publication of the Conflict Minerals Due Diligence White paper and discussed future plans to review and improve the white paper.
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