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IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals
December 15, 2015 | IPCEstimated reading time: 2 minutes
The D-64 Printed Electronics Final Assembly Subcommittee and D-64a Printed Electronics Terms and Definitions Task Group announced publication of IPC/JPCA-6901, Performance Requirements for Printed Electronics Assemblies and IPC-6903, Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry), respectively. The groups will formally celebrate these new standards at APEX/EXPO.
D-64 is now undertaking development of IPC-6902, Qualification and Performance Specifications for Printed Electronics (Additive Circuitry). It is doing so as a joint effort with the D-61 Printed Electronics Design Subcommittee. That subcommittee launched work on IPC-2292, IPC-2292, Design Standard for Printed Electronics on Flexible Substrates, which will be the first in a potential series of design standards for printed electronics. Because these groups’ efforts are so closely intertwined, they will meet jointly throughout their processes.
The D-62 Printed Electronics Base Materials Substrates Subcommittee and D-63 Printed Electronics Functional Materials Subcommittee seek to expand the reach for the materials specification sheets in their standards. Both groups plan to create generic categories of materials and will begin gathering information from suppliers to build these categories and come up with requirement ranges for generic specification sheets.
The D-65 Printed Electronics Test Methods Development Subcommittee continues to make headway creating standardized testing for flexibility and stretchability.
Conflict Minerals
The E-30 Committee celebrated the publication of the Conflict Minerals Due Diligence White paper and discussed future plans to review and improve the white paper.
Page 2 of 2Suggested Items
SPEA Expands in Southeast Asia with New Subsidiary in Thailand
05/17/2024 | SPEASPEA, a global leader in automatic test equipment for the manufacturing of semiconductor, microelectronic and electronic devices, today announced the opening of its new subsidiary in Thailand. This expansion marks a significant step forward in SPEA's commitment to serving the growing Southeast Asian microchip and electronics market with leading-edge manufacturing machinery and equipment.
Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
05/17/2024 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
IPC Releases May 2024 Global Sentiment of the Electronics Supply Chain Report
05/16/2024 | IPCSentiment among electronics manufacturers fell this month, after hitting a new high in April. Despite the decline, sentiment remains historically high according to IPC’s May Sentiment of the Global Electronics Manufacturing Supply Chain Report.
Sypris Reports Q1 2024 Results; Revenue Up 10%
05/15/2024 | Sypris Solutions Inc.The Company’s first quarter 2024 consolidated revenue increased 10.1% to $35.6 million compared with the prior-year quarter, representing the 11th quarter of double-digit year-over-year growth during the past 12 quarterly periods.