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IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals
December 15, 2015 | IPCEstimated reading time: 2 minutes
The D-64 Printed Electronics Final Assembly Subcommittee and D-64a Printed Electronics Terms and Definitions Task Group announced publication of IPC/JPCA-6901, Performance Requirements for Printed Electronics Assemblies and IPC-6903, Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry), respectively. The groups will formally celebrate these new standards at APEX/EXPO.
D-64 is now undertaking development of IPC-6902, Qualification and Performance Specifications for Printed Electronics (Additive Circuitry). It is doing so as a joint effort with the D-61 Printed Electronics Design Subcommittee. That subcommittee launched work on IPC-2292, IPC-2292, Design Standard for Printed Electronics on Flexible Substrates, which will be the first in a potential series of design standards for printed electronics. Because these groups’ efforts are so closely intertwined, they will meet jointly throughout their processes.
The D-62 Printed Electronics Base Materials Substrates Subcommittee and D-63 Printed Electronics Functional Materials Subcommittee seek to expand the reach for the materials specification sheets in their standards. Both groups plan to create generic categories of materials and will begin gathering information from suppliers to build these categories and come up with requirement ranges for generic specification sheets.
The D-65 Printed Electronics Test Methods Development Subcommittee continues to make headway creating standardized testing for flexibility and stretchability.
Conflict Minerals
The E-30 Committee celebrated the publication of the Conflict Minerals Due Diligence White paper and discussed future plans to review and improve the white paper.
Page 2 of 2Suggested Items
DuPont Announces Additional Directors for the Planned Independent Electronics Company
04/18/2025 | DuPontDuPont announced that Karin De Bondt and Anne Noonan will become members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont, which is targeted for November 1, 2025.
Navigating Robotics Deployment Challenges with SINBON
04/18/2025 | PRNewswireIn spite of the potential for robotics technology to expand productivity, several implementation challenges continue to stand in the way of more widespread adoption.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
04/17/2025 | BUSINESS WIREAs part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio.