-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals
December 15, 2015 | IPCEstimated reading time: 2 minutes
The D-64 Printed Electronics Final Assembly Subcommittee and D-64a Printed Electronics Terms and Definitions Task Group announced publication of IPC/JPCA-6901, Performance Requirements for Printed Electronics Assemblies and IPC-6903, Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry), respectively. The groups will formally celebrate these new standards at APEX/EXPO.
D-64 is now undertaking development of IPC-6902, Qualification and Performance Specifications for Printed Electronics (Additive Circuitry). It is doing so as a joint effort with the D-61 Printed Electronics Design Subcommittee. That subcommittee launched work on IPC-2292, IPC-2292, Design Standard for Printed Electronics on Flexible Substrates, which will be the first in a potential series of design standards for printed electronics. Because these groups’ efforts are so closely intertwined, they will meet jointly throughout their processes.
The D-62 Printed Electronics Base Materials Substrates Subcommittee and D-63 Printed Electronics Functional Materials Subcommittee seek to expand the reach for the materials specification sheets in their standards. Both groups plan to create generic categories of materials and will begin gathering information from suppliers to build these categories and come up with requirement ranges for generic specification sheets.
The D-65 Printed Electronics Test Methods Development Subcommittee continues to make headway creating standardized testing for flexibility and stretchability.
Conflict Minerals
The E-30 Committee celebrated the publication of the Conflict Minerals Due Diligence White paper and discussed future plans to review and improve the white paper.
Page 2 of 2Suggested Items
Hon Hai Reports New June Sales High Amid AI Boom
07/07/2025 | I-Connect007 Editorial TeamTaiwan-based manufacturing giant Hon Hai Precision Industry Co. reported on July 5 that its sales for June rose 10 percent from the previous year, driven by cloud and networking growth because of the boom in artificial intelligence (AI), the Taipei Times reported.
Electronics Industry Wrestles with Cost Pressures and Weaker Profitability
07/07/2025 | Global Electronics AssociationElectronics manufacturers are facing rising material and labor costs according to the Global Electronics Association’s June Sentiment of the Global Electronics Manufacturing Supply Chain Report.
Naprotek Appoints James Eisenhaure as Chief Financial Officer
07/07/2025 | Naprotek LLCNaprotek, LLC, a leading provider of mission-critical electronics technology solutions, today announced that James Eisenhaure has been appointed Chief Financial Officer, effective June 30. Eisenhaure has been serving as interim CFO since earlier this year and now formally steps into the role.
Yannick Green Joins Technica USA as Business Development/Account Manager for Northern California and Northern Nevada
07/07/2025 | Technica USATechnica USA is proud to announce that industry veteran Yannick Green has rejoined Team Technica as Business Development/Account Manager, supporting both supply partners and PCBA customers across Northern California and Northern Nevada.
I-Connect007’s Editor’s Choice: Five Must-Reads for the Week
07/04/2025 | Marcy LaRont, I-Connect007For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring. One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara.