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Advanced Electronics Packaging Digest

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Suggested Items

Asian Semiconductor Manufacturer Selects LPKF Glass Processing Equipment

09/24/2026 | LPKF
LPKF Laser & Electronics SE has received a letter of Intent (LOI) for the purchase of NEXAR LIDE systems from a leading Asian advanced packaging manufacturer for the production ramp-up of glass substrates.

Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

09/16/2026 | PRNewswire
Spirox, hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications.

Trouble in Your Tank: Pre-electroless Causes of Voids

09/02/2026 | Michael Carano -- Column: Trouble in Your Tank
To support advanced 2.5D and 3D heterogeneous integration, product and motherboard designs are now using higher layer counts. As layer counts increase, plated through-holes (PTHs) become deeper and higher in aspect ratio, making it more difficult to achieve a continuous, void-free copper deposit. Drilling these thicker panels and higher aspect ratio vias adds another layer of complexity. Since there are many potential causes of PTH voiding, I’ll focus on pre-electroless copper causes, including drilling.

Ventec’s Glass-Free Revolution: Smarter Material Data for Next-Gen PCB Designs

08/13/2026 | Ventec
At Ventec, we’re excited to see our Glass-Free Bondply materials now included in the latest release of Polar Instruments’ Speedstack.

Polar's Speedstack Eases Material Identification and Adds Ventec Glass-Free Materials

08/10/2026 | Polar Instruments
Polar’s Speedstack mid-year release adds Ventec Glass-Free materials to online resources, and incorporates improved capability of identifying multi material families in the stack documentation, giving users “at a glance” visual views of material types in a stack.
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